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參數(shù)資料
| 型號： | LPC2917 |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 32位微控制器 |
| 英文描述： | ARM9 microcontroller with CAN and LIN |
| 中文描述： | 具有CAN和LIN的ARM9微控制器 |
| 文件頁數(shù)： | 62/68頁 |
| 文件大小： | 384K |
| 代理商： | LPC2917 |
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LPC2917_19_1
NXP B.V. 2007. All rights reserved.
Preliminary data sheet
Rev. 1.01 — 15 November 2007
62 of 68
NXP Semiconductors
LPC2917/19
ARM9 microcontroller with CAN and LIN
[1]
For more detailed information on the BGA packages refer to the
(LF)BGA Application Note
(AN01026); order a copy from your NXP
Semiconductors sales office.
[2]
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with
respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of
the moisture in them (the so called popcorn effect).
[3]
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
[4]
Hot bar soldering or manual soldering is suitable for PMFP packages.
[5]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed
through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217
°
C
±
10
°
C
measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible.
[6]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate
between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the
heatsink surface.
[7]
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction. The package footprint
must incorporate solder thieves downstream and at the side corners.
[8]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for
packages with a pitch (e) equal to or smaller than 0.65 mm.
[9]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely
not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[10] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil.
However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate
soldering profile can be provided on request.
Surface mount
BGA, HTSSON..T
[5]
, LBGA,
LFBGA, SQFP, SSOP..T
[5]
,
TFBGA, VFBGA, XSON
DHVQFN, HBCC, HBGA, HLQFP,
HSO, HSOP, HSQFP, HSSON,
HTQFP, HTSSOP, HVQFN,
HVSON, SMS
PLCC
[7]
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
CWQCCN..L
[10]
, WQCCN..L
[10]
not suitable
suitable
not suitable
[6]
suitable
suitable
not recommended
[7][8]
not recommended
[9]
not suitable
suitable
suitable
suitable
not suitable
Table 34.
Mounting
Suitability of IC packages for wave, reflow and dipping soldering methods
…continued
Package
[1]
Soldering method
Wave
Reflow
[2]
Dipping
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| LPC2917/01 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:ARM9 microcontroller with CAN and LIN |
| LPC2917FBD144 | 制造商:NXP Semiconductors 功能描述:IC MCU 32BIT ARM968 SMD LQFP144 |
| LPC2917FBD144,551 | 功能描述:ARM微控制器 - MCU ARM968 512K FL/48K RAM LIN 2.0 RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 處理器系列:STM32F373xx 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:72 MHz 程序存儲器大小:256 KB 數(shù)據(jù) RAM 大小:32 KB 片上 ADC:Yes 工作電源電壓:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:LQFP-48 安裝風(fēng)格:SMD/SMT |
| LPC2917FBD144/01 | 制造商:NXP Semiconductors 功能描述:MCU, 32BIT, ARM968E-S, 125MHZ, LQFP-144 制造商:NXP Semiconductors 功能描述:MCU, 32BIT, ARM968E-S, 125MHZ, LQFP-144, Controller Family/Series:LPC2900, Core Size:32bit, No. of I/O's:108, Supply Voltage Min:1.71V, Supply Voltage Max:1.89V, Digital IC Case Style:LQFP, No. of Pins:144, Program Memory Size:512KB, |
| LPC2917FBD144/01/, | 功能描述:ARM微控制器 - MCU ARM968 512K FL/48K RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 處理器系列:STM32F373xx 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:72 MHz 程序存儲器大小:256 KB 數(shù)據(jù) RAM 大小:32 KB 片上 ADC:Yes 工作電源電壓:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:LQFP-48 安裝風(fēng)格:SMD/SMT |
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