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參數(shù)資料
| 型號： | LPC2917 |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 32位微控制器 |
| 英文描述： | ARM9 microcontroller with CAN and LIN |
| 中文描述： | 具有CAN和LIN的ARM9微控制器 |
| 文件頁數(shù)： | 61/68頁 |
| 文件大?。?/td> | 384K |
| 代理商： | LPC2917 |
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LPC2917_19_1
NXP B.V. 2007. All rights reserved.
Preliminary data sheet
Rev. 1.01 — 15 November 2007
61 of 68
NXP Semiconductors
LPC2917/19
ARM9 microcontroller with CAN and LIN
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal results:
Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
For packages with leads on two sides and a pitch (e):
–
larger than or equal to 1.27 mm, the footprint longitudinal axis is
preferred
to be
parallel to the transport direction of the printed-circuit board;
–
smaller than 1.27 mm, the footprint longitudinal axis
must
be parallel to the
transport direction of the printed-circuit board.
The footprint must incorporate solder thieves at the downstream end.
For packages with leads on four sides, the footprint must be placed at a 45
°
angle to
the transport direction of the printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must be fixed with a droplet of
adhesive. The adhesive can be applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the adhesive is cured.
Typical dwell time of the leads in the wave ranges from 3 seconds to 4 seconds at 250
°
C
or 265
°
C, depending on solder material applied, SnPb or Pb-free respectively.
A mildly-activated flux will eliminate the need for removal of corrosive residues in most
applications.
14.3.3
Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage
(24 V or less) soldering iron applied to the flat part of the lead. Contact time must be
limited to 10 seconds at up to 300
°
C.
When using a dedicated tool, all other leads can be soldered in one operation within
2 seconds to 5 seconds between 270
°
C and 320
°
C.
14.4 Package related soldering information
Table 34.
Mounting
Suitability of IC packages for wave, reflow and dipping soldering methods
Package
[1]
Soldering method
Wave
suitable
suitable
[3]
not suitable
Reflow
[2]
not suitable
Dipping
suitable
Through-hole mount
CPGA, HCPGA
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP
[4]
Through-hole-surface
mount
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| LPC2917/01 | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:ARM9 microcontroller with CAN and LIN |
| LPC2917FBD144 | 制造商:NXP Semiconductors 功能描述:IC MCU 32BIT ARM968 SMD LQFP144 |
| LPC2917FBD144,551 | 功能描述:ARM微控制器 - MCU ARM968 512K FL/48K RAM LIN 2.0 RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 處理器系列:STM32F373xx 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:72 MHz 程序存儲器大小:256 KB 數(shù)據(jù) RAM 大小:32 KB 片上 ADC:Yes 工作電源電壓:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:LQFP-48 安裝風(fēng)格:SMD/SMT |
| LPC2917FBD144/01 | 制造商:NXP Semiconductors 功能描述:MCU, 32BIT, ARM968E-S, 125MHZ, LQFP-144 制造商:NXP Semiconductors 功能描述:MCU, 32BIT, ARM968E-S, 125MHZ, LQFP-144, Controller Family/Series:LPC2900, Core Size:32bit, No. of I/O's:108, Supply Voltage Min:1.71V, Supply Voltage Max:1.89V, Digital IC Case Style:LQFP, No. of Pins:144, Program Memory Size:512KB, |
| LPC2917FBD144/01/, | 功能描述:ARM微控制器 - MCU ARM968 512K FL/48K RoHS:否 制造商:STMicroelectronics 核心:ARM Cortex M4F 處理器系列:STM32F373xx 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:72 MHz 程序存儲器大小:256 KB 數(shù)據(jù) RAM 大小:32 KB 片上 ADC:Yes 工作電源電壓:1.65 V to 3.6 V, 2 V to 3.6 V, 2.2 V to 3.6 V 工作溫度范圍:- 40 C to + 85 C 封裝 / 箱體:LQFP-48 安裝風(fēng)格:SMD/SMT |
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