參數(shù)資料
型號: LPC2460
廠商: NXP Semiconductors N.V.
英文描述: Flashless 16-bit/32-bit micro; Ethernet, CAN, ISP/IAP, USB 2.0 device/host/OTG, external memory interface
中文描述: 毛邊16-bit/32-bit微,以太網(wǎng),CAN,供應商/國際檢察官聯(lián)合會,USB 2.0設(shè)備/主機/ OTG功能,外部存儲器接口
文件頁數(shù): 23/67頁
文件大小: 340K
代理商: LPC2460
LPC2460_0
NXP B.V. 2007. All rights reserved.
Preliminary data sheet
Rev. 00.01 — 5 October 2007
23 of 67
NXP Semiconductors
LPC2460
Fast communication chip
[1]
5 V tolerant pad providing digital I/O functions with TTL levels and hysteresis.
[2]
5 V tolerant pad providing digital I/O functions (with TTL levels and hysteresis) and analog input. When configured as a ADC input,
digital section of the pad is disabled.
[3]
5 V tolerant pad providing digital I/O with TTL levels and hysteresis and analog output function. When configured as the DAC output,
digital section of the pad is disabled.
[4]
Open-drain 5 V tolerant digital I/O I
2
C-bus 400 kHz specification compatible pad. It requires an external pull-up to provide output
functionality. When power is switched off, this pin connected to the I
2
C-bus is floating and does not disturb the I
2
C lines.
[5]
Pad provides digital I/O and USB functions. It is designed in accordance with the
USB specification, revision 2.0
(Full-speed and
Low-speed mode only).
[6]
5 V tolerant pad with 5 ns glitch filter providing digital I/O functions with TTL levels and hysteresis.
[7]
5 V tolerant pad with 20 ns glitch filter providing digital I/O function with TTL levels and hysteresis.
[8]
Pad provides special analog functionality.
[9]
Pad provides special analog functionality.
[10] Pad provides special analog functionality.
[11] Pad provides special analog functionality.
[12] Pad provides special analog functionality.
[13] Pad provides special analog functionality.
[14] Pad provides special analog functionality.
7.
Functional description
7.1 Architectural overview
The LPC2460 microcontroller consists of an ARM7TDMI-S CPU with emulation support,
the ARM7 local bus for closely coupled, high-speed access to the majority of on-chip
memory, the AMBA AHB interfacing to high-speed on-chip peripherals and external
V
DD(3V3)
15, 60,
71, 89,
112,
125,
146,
165,
181,
198
[11]
G3,
P6, P8,
U13,
P17,
K16,
C17,
B13,
C9,
D7
[11]
J4, L14,
G14
[12]
H4, P11,
D11
[13]
G4
[14]
I
3.3 V supply voltage:
This is the power supply voltage for the I/O ports.
NC
30, 117,
141
[12]
26, 86,
174
[13]
20
[14]
I
Not Connected pins:
These pins must be left unconnected (floating).
V
DD(DCDC)(3V3)
I
3.3 V DC-to-DC converter supply voltage:
This is the power supply for
the on-chip DC-to-DC converter.
analog 3.3 V pad supply voltage:
This should be nominally the same
voltage as V
DD(3V3)
but should be isolated to minimize noise and error.
This voltage is used to power the ADC and DAC.
ADC reference:
This should be nominally the same voltage as V
DD(3V3)
but should be isolated to minimize noise and error. The level on this pin is
used as a reference for ADC and DAC.
RTC power supply:
3.3 V on this pin supplies the power to the RTC.
V
DDA
I
VREF
24
[14]
K1
[14]
I
VBAT
38
[14]
M3
[14]
I
Table 4.
Symbol
Pin description
…continued
Pin
Ball
Type
Description
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