參數(shù)資料
型號： KAB03D100M-TLGP
廠商： SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述： Multi-Chip Package MEMORY
中文描述： 多芯片封裝存儲器
文件頁數(shù)： 10/72頁
文件大?。?/td> 1378K
代理商： KAB03D100M-TLGP
KAB0xD100M - TxGP
Revision 1.11
August 2003
- 10 -
MCP MEMORY
SEC Only
Table 3. NOR Flash Memory Bottom Block Address (KAB01D100/KAB03D100)
KAB
01D1
00
KAB
03D1
00
Block
Block Address
Block Size
(KB/KW)
Address Range
A21
A20
A19
A18
A17
A16
A15
A14
A13
A12
Byte Mode
Word Mode
Bank2
Bank2
BA98
1
0
1
1
0
1
1
X
X
X
64/32
5B0000H-5BFFFFH
2D8000H-2DFFFFH
BA97
1
0
1
1
0
1
0
X
X
X
64/32
5A0000H-5AFFFFH
2D0000H-2D7FFFH
BA96
1
0
1
1
0
0
1
X
X
X
64/32
590000H-59FFFFH
2C8000H-2CFFFFH
BA95
1
0
1
1
0
0
0
X
X
X
64/32
580000H-58FFFFH
2C0000H-2C7FFFH
BA94
1
0
1
0
1
1
1
X
X
X
64/32
570000H-57FFFFH
2B8000H-2BFFFFH
BA93
1
0
1
0
1
1
0
X
X
X
64/32
560000H-56FFFFH
2B0000H-2B7FFFH
BA92
1
0
1
0
1
0
1
X
X
X
64/32
550000H-55FFFFH
2A8000H-2AFFFFH
BA91
1
0
1
0
1
0
0
X
X
X
64/32
540000H-54FFFFH
2A0000H-2A7FFFH
BA90
1
0
1
0
0
1
1
X
X
X
64/32
530000H-53FFFFH
298000H-29FFFFH
BA89
1
0
1
0
0
1
0
X
X
X
64/32
520000H-52FFFFH
290000H-297FFFH
BA88
1
0
1
0
0
0
1
X
X
X
64/32
510000H-51FFFFH
288000H-28FFFFH
BA87
1
0
1
0
0
0
0
X
X
X
64/32
500000H-50FFFFH
280000H-287FFFH
BA86
1
0
0
1
1
1
1
X
X
X
64/32
4F0000H-4FFFFFH
278000H-27FFFFH
BA85
1
0
0
1
1
1
0
X
X
X
64/32
4E0000H-4EFFFFH
270000H-277FFFH
BA84
1
0
0
1
1
0
1
X
X
X
64/32
4D0000H-4DFFFFH
268000H-26FFFFH
BA83
1
0
0
1
1
0
0
X
X
X
64/32
4C0000H-4CFFFFH
260000H-267FFFH
BA82
1
0
0
1
0
1
1
X
X
X
64/32
4B0000H-4BFFFFH
258000H-25FFFFH
BA81
1
0
0
1
0
1
0
X
X
X
64/32
4A0000H-4AFFFFH
250000H-257FFFH
BA80
1
0
0
1
0
0
1
X
X
X
64/32
490000H-49FFFFH
248000H-24FFFFH
BA79
1
0
0
1
0
0
0
X
X
X
64/32
480000H-48FFFFH
240000H-247FFFH
BA78
1
0
0
0
1
1
1
X
X
X
64/32
470000H-47FFFFH
238000H-23FFFFH
BA77
1
0
0
0
1
1
0
X
X
X
64/32
460000H-46FFFFH
230000H-237FFFH
BA76
1
0
0
0
1
0
1
X
X
X
64/32
450000H-45FFFFH
228000H-22FFFFH
BA75
1
0
0
0
1
0
0
X
X
X
64/32
440000H-44FFFFH
220000H-227FFFH
BA74
1
0
0
0
0
1
1
X
X
X
64/32
430000H-43FFFFH
218000H-21FFFFH
BA73
1
0
0
0
0
1
0
X
X
X
64/32
420000H-42FFFFH
210000H-217FFFH
BA72
1
0
0
0
0
0
1
X
X
X
64/32
410000H-41FFFFH
208000H-20FFFFH
BA71
1
0
0
0
0
0
0
X
X
X
64/32
400000H-40FFFFH
200000H-207FFFH
相關PDF資料
PDF描述
KAB03D100M-TNGP Multi-Chip Package MEMORY
KAB04D100M-TLGP Multi-Chip Package MEMORY
KAB04D100M-TNGP Multi-Chip Package MEMORY
KAB01D100M Tantalum Conformal-Coated Capacitor; Capacitance: 22uF; Voltage: 10V; Packaging: Tape & Reel
KAB02D100M-TLGP Tantalum Conformal-Coated Capacitor; Capacitance: 22uF; Voltage: 10V; Packaging: Tape & Reel
相關代理商/技術參數(shù)
參數(shù)描述
KAB03D100M-TNGP 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:Multi-Chip Package MEMORY
KAB04D100M-TLGP 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:Multi-Chip Package MEMORY
KAB04D100M-TNGP 制造商:SAMSUNG 制造商全稱:Samsung semiconductor 功能描述:Multi-Chip Package MEMORY
KAB-1 功能描述:保險絲 TRON RECTIFIER FUSE RoHS:否 制造商:Littelfuse 產品:Surface Mount Fuses 電流額定值:0.5 A 電壓額定值:600 V 保險絲類型:Fast Acting 保險絲大小/組:Nano 尺寸:12.1 mm L x 4.5 mm W 安裝風格: 端接類型:SMD/SMT 系列:485
KAB-1/2 制造商:COOPER BUSSMANN 功能描述:TRON RECTIFIER FUSE
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