參數(shù)資料
型號: HYB18T512400AF-3S
廠商: INFINEON TECHNOLOGIES AG
英文描述: 512-Mbit DDR2 SDRAM
中文描述: 512兆位DDR2 SDRAM的
文件頁數(shù): 66/117頁
文件大小: 2102K
代理商: HYB18T512400AF-3S
HYB18T512[40/80/16]0AF–[3/3S/3.7/5]
512-Mbit DDR2 SDRAM
Functional Description
Data Sheet
66
Rev. 1.3, 2005-01
09112003-SDM9-IQ3P
3.23.3
Read or Write to Precharge Command Spacing Summary
The following table summarizes the minimum command delays between Read, Read w/AP, Write, Write w/AP to
the Precharge commands to the same banks and Precharge-All commands.
Table 18
From Command
Minimum Command Delays
To Command
Minimum Delay between “From
Command” to “To Command”
AL + BL/2 + max(
t
RTP
, 2) - 2
×
t
CK
Unit
Note
READ
PRECHARGE (to same banks as
READ)
PRECHARGE-ALL
PRECHARGE (to same banks as
READ w/AP)
PRECHARGE-ALL
PRECHARGE (to same banks as
WRITE)
PRECHARGE-ALL
PRECHARGE (to same banks as
WRITE w/AP)
PRECHARGE-ALL
PRECHARGE (to same banks as
PRECHARGE)
PRECHARGE-ALL
PRECHARGE
PRECHARGE-ALL
t
CK
1)2)
1) RU{
t
RTP
(ns) /
t
CK
(ns)} must be used, where RU stands for “Round Up”
2) For a given bank, the precharge period should be counted from the latest precharge command, either one bank precharge
or precharge-all, issued to that bank. The precharge period is satisfied after
t
RP,all
depending on the latest precharge
command issued to that bank
AL + BL/2 + max(
t
RTP
, 2) - 2
×
t
CK
AL + BL/2 + max(
t
RTP
, 2) - 2
×
t
CK
t
CK
t
CK
1)2)
READ w/AP
1)2)
AL + BL/2 + max(
t
RTP
, 2) - 2
×
t
CK
WL + BL/2 +
t
WR
t
CK
t
CK
1)2)
WRITE
2)
WL + BL/2 +
t
WR
WL + BL/2 + WR
t
CK
t
CK
2)
WRITE w/AP
2)
WL + BL/2 + WR
1
t
CK
t
CK
2)
PRECHARGE
2)
1
1
1
t
CK
t
CK
t
CK
2)
PRECHARGE-ALL
2)
2)
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相關代理商/技術參數(shù)
參數(shù)描述
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HYB18T512800BF-3.7 功能描述:IC DDR2 SDRAM 512MBIT 60TFBGA RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:- 標準包裝:150 系列:- 格式 - 存儲器:EEPROMs - 串行 存儲器類型:EEPROM 存儲容量:4K (2 x 256 x 8) 速度:400kHz 接口:I²C,2 線串口 電源電壓:2.5 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-VFDFN 裸露焊盤 供應商設備封裝:8-DFN(2x3) 包裝:管件 產(chǎn)品目錄頁面:1445 (CN2011-ZH PDF)