Pad No.
Pad Name
I/O Mask Option
Description
77
PB4/SOUT
I/O
or
O
I/O or
SOUT Output
Selectable as bidirectional input/output or serial
data output master by mask option. On
bidirectional input/output mode, software in-
structions determine whether it is a CMOS out-
put or Schmitt trigger input . On serial output
mode, SOUT pin is a CMOS output. PB4 shares
pad with SOUT.
78
79
PB3
PB2
I/O
Software instructions determine whether it is a
CMOS output or Schmitt trigger input with
pull-high resistor. When the PB6/TMR1/RTF
pad is selected to be in RTF mode, the PB3, PB2
pull-high resistor is not present.
87~80
PA0~PA7
I/O
Wake-up
or
None
Wake-up
Bidirectional 8-bit input/output port. Each bit
can be configured as a wake-up input by mask
option. Software instructions determine whether
it is a CMOS output or Schmitt trigger input with
pull-high resistor.
88
89
XIN/PC7/SEG63
XOUT/PC6/SEG62
I
or
I/O
or
O
Crystal or I/O
or Segment
Output
Selectable as 32768Hz crystal or bidirectional
input/output or segment signal output by mask
option. 32768Hz crystal for timer3 and LCD
clock source. XOUT and PC6 share with SEG62
Pad,XIN and PC7 share with SEG63 pad.
95~90
103~96
111~104
PC0~5/SEG56~61
PD0~7/SEG48~55
PE0~7/SEG40~47
I/O
or
O
I/O or
Segment
Output
Three bidirectional 8-bit input/output ports.
Software instructions determine the CMOS
output or Schmitt trigger input with pull-high
resistor. PC, PD, PE can be individually
optioned for segment output by mask option.
PC0~PC7 share pads with SEG56~SEG63,
PD0~PD7 share pads with SEG48~SEG55, and
PE0~PE7 share pads with SEG40~SEG47.
Absolute Maximum Ratings
Supply Voltage.............................. 0.3V to 3.6V
Storage Temperature ................ 50 C to 125 C
Input Voltage.................V
SS
0.3V to V
DD
+0.3V
Operating Temperature..................0 C to 70 C
Note: These are stress ratings only. Stresses exceeding the range specified under Absolute Maxi-
mumRatings maycausesubstantialdamagetothedevice.Functionaloperationofthisdevice
at other conditions beyond those listed in the specification is not implied and prolonged expo-
sure to extreme conditions may affect device reliability.
HTG2190
Rev. 1.00
7
June 29, 2001