參數(shù)資料
型號: FDMC2610_07
廠商: Fairchild Semiconductor Corporation
英文描述: N-Channel UltraFET Trench㈢ MOSFET 200V, 9.5A, 200mヘ
中文描述: N溝道UltraFET海溝㈢MOSFET的為200V,9.5A,200米ヘ
文件頁數(shù): 2/7頁
文件大?。?/td> 347K
代理商: FDMC2610_07
F
M
FDMC2610 Rev.C
www.fairchildsemi.com
2
Electrical Characteristics
T
J
= 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Off Characteristics
BV
DSS
Δ
BV
DSS
Δ
T
J
Drain to Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
I
D
= 250
μ
A, V
GS
= 0V
200
V
I
D
= 250
μ
A, referenced to 25°C
199
mV/°
C
I
DSS
Zero Gate Voltage Drain Current
V
DS
= 160V,
V
GS
= 0V
V
GS
= ±20V, V
DS
= 0V
1
μ
A
T
J
= 125°C
100
±100
I
GSS
Gate to Source Leakage Current
nA
On Characteristics
V
GS(th)
Δ
V
GS(th)
Δ
T
J
Gate to Source Threshold Voltage
Gate to Source Threshold Voltage
Temperature Coefficient
V
GS
= V
DS
, I
D
= 250
μ
A
2
3.2
4
V
I
D
= 250
μ
A, referenced to 25°C
-9.9
mV/°C
r
DS(on)
Drain to Source On Resistance
V
GS
= 10V, I
D
= 2.2A
V
GS
= 6V, I
D
= 1.5A
V
GS
= 10V, I
D
= 2.2A , T
J
= 125°C
V
DS
= 5V, I
D
= 2.2A
175
188
347
7
200
215
397
m
Ω
g
FS
Forward Transconductance
S
Dynamic Characteristics
C
iss
C
oss
C
rss
R
g
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
V
DS
= 100V, V
GS
= 0V,
f = 1MHz
720
41
12
0.7
960
55
20
pF
pF
pF
Ω
f = 1MHz
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
Q
g(TOT)
Q
gs
Q
gd
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Gate Charge at 10V
Gate to Source Gate Charge
Gate to Drain “Miller” Charge
V
DD
= 100V, I
D
= 2.2A
V
GS
= 10V, R
GEN
= 24
Ω
17
13
29
16
12.3
3
3.6
31
24
47
29
18
ns
ns
ns
ns
nC
nC
nC
V
GS
= 0V to 10V V
DD
= 100V
I
D
= 2.2A
Drain-Source Diode Characteristics
V
SD
t
rr
Q
rr
Source to Drain Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
V
GS
= 0V, I
S
= 2.2A (Note 2)
0.8
69
114
1.2
104
171
V
ns
nC
I
F
= 2.2A, di/dt = 100A/
μ
s
Notes:
1:
R
is determined with the device mounted on a 1in
2
pad 2 oz copper pad on a 1.5
x 1.5 in. board of FR-4 material. R
θ
JC
is guaranteed by design while
R
θ
CA
is determined by
the user's board design.
2:
Pulse Test: Pulse Width < 30
0
μ
s, Duty cycle < 2.0%.
a. 60°C/W when mounted on
a 1 in
pad of 2 oz copper
b. 135°C/W when mounted on a
minimum pad of 2 oz copper
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