Altera Corporation
10–1
May 2007
10. Package Information for
Stratix II & Stratix II GX
Devices
Introduction
This chapter provides package information for Altera Stratix II and
Stratix II GX devices, including:
■
Device and package cross reference
■
Thermal resistance values
■
Package outlines
devices, respectively, are available in FineLine BGA (FBGA) packages.
Table 10–1. Stratix II Devices in FBGA Packages
Device
Package
Pins
EP2S15
Flip-chip FBGA
484
Flip-chip FBGA
672
EP2S30
Flip-chip FBGA
484
Flip-chip FBGA
672
EP2S60
Flip-chip FBGA
484
Flip-chip FBGA
672
Flip-chip FBGA
1,020
EP2S90
Flip-chip FBGA
484
Flip-chip FBGA
780
Flip-chip FBGA
1,020
Flip-chip FBGA
1,508
EP2S130
Flip-chip FBGA
780
Flip-chip FBGA
1,020
Flip-chip FBGA
1,508
EP2S180
Flip-chip FBGA
1,020
Flip-chip FBGA
1,508
SII52010-4.3