參數(shù)資料
型號： DS3112
英文描述： RECT BRIDGE GPP 15A 400V GBJ
中文描述： TEMPE T3/E3復(fù)用器、3.3V T3/E3成幀器及M13/E13/G.747復(fù)用器
文件頁數(shù)： 32/135頁
文件大?。?/td> 585K
代理商： DS3112
DS3112
32 of 135
Bit 3/T3/E3 Force Receive Framer Resynchronization (T3E3RSY).
A zero to one transition on this bit
will cause the T3 receive framer or the E3 receive framer to resynchronize. This bit must be cleared and
set again for a subsequent resynchronization to occur.
Bits 8 to 15/Chip Revision ID Bit 0 to 7 (ID0 to ID7).
Read-only. Contact the factory for details on the
meaning of the ID bits.
4.2 Master Configuration Registers Description
Register Name:
MC1
Register Description:
Master Configuration Register 1
Register Address:
02h
Bit #
7
6
5
4
Name
FTSOFC LOTCMC
UNI
MECU
Default
0
0
0
0
Bit #
15
14
13
12
Name
n/a
n/a
n/a
n/a
Default
-
-
-
-
Note:
Bits that are underlined are read-only; all other bits are read-write.
Bit 0/Zero Code Suppression Disable (ZCSD).
0 = enable the B3ZS and HDB3 encoders/decoders
1 = disable the B3ZS and HDB3 encoders/decoders
Bit 1/T3/E3 Unchannelized Mode Enable (UNCHEN).
When this bit is set low, the M13/E13/G.747
multiplexer is enabled and data at the FTD input is ignored. When this bit is set high, the M13/E13/G.747
multiplexer is disabled and the LTDAT inputs are ignored. The table below displays which bits are not
sampled at the FTD input when UNCHEN = 1.
DS3112 MODE
BITS POSITIONS NOT SAMPLED AT FTD
T3 M23 (C-Bit Parity Disabled)
T3 C-Bit Parity
E3
0 = enable the M13/E13/G.747 multiplexers and disable the FTD Input
1 = disable the M13/E13/G.747 multiplexers and enable the FTD Input
3
2
1
0
AECU
0
CBEN
0
UNCHEN
0
ZCSD
0
11
10
9
8
LLTM
0
DENMS
0
LRCCEN
0
LTCCEN
0
F/P/M/C/X
F/P/M/X
FAS/Sn/RAI
相關(guān)PDF資料
PDF描述
DS3112N RECT BRIDGE GPP 15A 600V GBJ
DS3112RD RECT BRIDGE GPP 15A 800V GBJ
DS3134 Chateau Channelized T1 And E1 And HDLC Controller
DS3160 Ultraframer DS3/E3/DS2/E2/DS1/E1/DS0
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
DS3112+ 功能描述:網(wǎng)絡(luò)控制器與處理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3112+W 功能描述:網(wǎng)絡(luò)控制器與處理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3112D1 功能描述:網(wǎng)絡(luò)控制器與處理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3112D1+ 功能描述:網(wǎng)絡(luò)控制器與處理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3112DK 功能描述:網(wǎng)絡(luò)開發(fā)工具 DS3112 Dev Kit RoHS:否 制造商:Rabbit Semiconductor 產(chǎn)品:Development Kits 類型:Ethernet to Wi-Fi Bridges 工具用于評估:RCM6600W 數(shù)據(jù)速率:20 Mbps, 40 Mbps 接口類型:802.11 b/g, Ethernet 工作電源電壓:3.3 V
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