參數(shù)資料
型號： DS3112
英文描述： RECT BRIDGE GPP 15A 400V GBJ
中文描述： TEMPE T3/E3復(fù)用器、3.3V T3/E3成幀器及M13/E13/G.747復(fù)用器
文件頁數(shù)： 126/135頁
文件大?。?/td> 585K
代理商： DS3112
DS3112
126 of 135
UNCHANNELIZED DUAL T3/E3 APPLICATION
Figure 14.1B
14.2 M13 Basics
M13 multiplexing is a two-step process of merging 28 T1 lines into a single T3 line. First, four of the T1
lines are merged into a single T2 rate and then seven T2 rates are merged to form the T3. The first step of
this process is called a M12 function since it is merging T1 lines into T2. The second step of this process
is called a M23 function since it is merging T2 lines into a T3. The term M13 implies that both M12 and
M23 are being performed to map 28 T1 lines into the T3. These two steps are independent and will be
discussed separately.
T CARRIER RATES
Table 14.2A
T CARRIER LEVEL
NOMINAL DATA RATE
(Mbps)
T1/DS1
1.544
T2/DS2
6.312
T3/DS3
44.736
T2 Framing Structure
To understand the M12 function users must understand T2 framing. The T2 frame structure is made up of
four subframes called M subframes (Figure 14.2A). The four M subframes are transmitted one after
another (...M1/M2/M3/M4/M1/M2...) to make up the complete T2 M frame data structure. Each M
subframe is made up of six blocks and each block is made up of 49 bits. The first bit of each block is
dedicated to overhead and the next 48 bits are the information bits where the T1 data will be placed for
transport. The definitions of the overhead bits are shown in Table 14.2B and the placements of the
overhead bits are shown in Figure 14.2A.
DS3134
CHATEAU
256
Channel
HDLC
Controller
PCI
Bus
DS3112
TEMPE
T3/E3
Framer &
M13/
E13/
G747
Mux
DS3150
T3/E3
Line
Interface
T3/E3
Line
OC-3/
OC-12/
OC-48
Mux
Optical
I/F
bipolar
I/F
NRZ
I/F
- or -
DS3112
TEMPE
T3/E3
Framer &
M13/
E13/
G747
Mux
DS3150
T3/E3
Line
Interface
T3/E3
Line
OC-3/
OC-12/
OC-48
Mux
Optical
I/F
bipolar
I/F
NRZ
I/F
- or -
44.2Mbps (T3) or
34Mbps (E3)
datastream
44.2Mbps (T3) or
34Mbps (E3)
datastream
相關(guān)PDF資料
PDF描述
DS3112N RECT BRIDGE GPP 15A 600V GBJ
DS3112RD RECT BRIDGE GPP 15A 800V GBJ
DS3134 Chateau Channelized T1 And E1 And HDLC Controller
DS3160 Ultraframer DS3/E3/DS2/E2/DS1/E1/DS0
DS3171 Single/Dual/Triple/Quad DS3/E3 Single-Chip Transceivers
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
DS3112+ 功能描述:網(wǎng)絡(luò)控制器與處理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3112+W 功能描述:網(wǎng)絡(luò)控制器與處理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3112D1 功能描述:網(wǎng)絡(luò)控制器與處理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3112D1+ 功能描述:網(wǎng)絡(luò)控制器與處理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 產(chǎn)品:Controller Area Network (CAN) 收發(fā)器數(shù)量: 數(shù)據(jù)速率: 電源電流（最大值）:595 mA 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:PBGA-400 封裝:Tray
DS3112DK 功能描述:網(wǎng)絡(luò)開發(fā)工具 DS3112 Dev Kit RoHS:否 制造商:Rabbit Semiconductor 產(chǎn)品:Development Kits 類型:Ethernet to Wi-Fi Bridges 工具用于評估:RCM6600W 數(shù)據(jù)速率:20 Mbps, 40 Mbps 接口類型:802.11 b/g, Ethernet 工作電源電壓:3.3 V
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