參數(shù)資料
型號(hào): AM42BDS640AGBC9IS
廠商: SPANSION LLC
元件分類: 存儲(chǔ)器
英文描述: Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
中文描述: SPECIALTY MEMORY CIRCUIT, PBGA93
封裝: 8 X 11.60 MM, FBGA-93
文件頁數(shù): 68/72頁
文件大?。?/td> 1064K
代理商: AM42BDS640AGBC9IS
November 1, 2002
Am42BDS640AG
69
P R E L I M INARY
SRAM DATA RETENTION
Notes:
1. CE1#s
≥ V
CC – 0.2 V, CE2s ≥ VCC – 0.2 V (CE1#s controlled) or CE2s ≤ 0.2 V (CE2s controlled).
2. Typical values are not 100% tested.
Figure 39.
CE1#s Controlled Data Retention Mode
Figure 40.
CE2s Controlled Data Retention Mode
Parameter
Symbol
Parameter Description
Test Setup
Min
Typ
Max
Unit
V
DR
V
CC for Data Retention
CS1#s
≥ V
CC – 0.2 V (Note 1)
1.0
2.2
V
I
DR
Data Retention Current
V
CC = 1.2 V, CE1#s ≥ VCC – 0.2 V
1.0
8A
t
SDR
Data Retention Set-Up Time
See data retention waveforms
0ns
tRDR
Recovery Time
tRC
ns
VDR
VCC
2.7V
2.2V
CE1#s
GND
Data Retention Mode
CE1#s
VCC - 0.2 V
tSDR
tRDR
VCC
2.7 V
0.4 V
DR
CE2s
GND
Data Retention Mode
tSDR
tRDR
CE2s < 0.2 V
相關(guān)PDF資料
PDF描述
AM42BDS640AG Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM49DL3208GB70FS SPECIALTY MEMORY CIRCUIT, PBGA69
AM4J-67205L-55 8K X 9 OTHER FIFO, 55 ns, CQCC32
AMS1-67205L-35 8K X 9 OTHER FIFO, 35 ns, PQCC32
AM50030C33 SNAP ACTING/LIMIT SWITCH, SPST, MOMENTARY, 0.1A, 30VDC, 2.4mm, PANEL MOUNT
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AM42BDS640AGBC9IT 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM42BDS640AGBD8IS 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM42BDS640AGBD8IT 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM42BDS640AGBD9I 制造商:Spansion 功能描述:COMBO 4MX16 FALSH + 1MX16 SRAM 1.8V 93FBGA - Trays
AM42BDS640AGBD9IS 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM