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參數(shù)資料
| 型號(hào)： | AM42BDS640AGBC9IS |
| 廠商： | SPANSION LLC |
| 元件分類： | 存儲(chǔ)器 |
| 英文描述： | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| 中文描述： | SPECIALTY MEMORY CIRCUIT, PBGA93 |
| 封裝： | 8 X 11.60 MM, FBGA-93 |
| 文件頁(yè)數(shù)： | 59/72頁(yè) |
| 文件大?。?/td> | 1064K |
| 代理商： | AM42BDS640AGBC9IS |
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November 1, 2002
Am42BDS640AG
61
P R E L I M INARY
AC CHARACTERISTICS
Wait State Decoding Addresses:
A14, A13, A12 = “101”
5 programmed, 7 total
A14, A13, A12 = “100”
4 programmed, 6 total
A14, A13, A12 = “011”
3 programmed, 5 total
A14, A13, A12 = “010”
2 programmed, 4 total
A14, A13, A12 = “001”
1 programmed, 3 total
A14, A13, A12 = “000”
0 programmed, 2 total
Note: Figure assumes address D0 is not at an address boundary, active clock edge is rising, and wait state is set to “101”.
Figure 32.
Example of Wait States Insertion (Standard Handshaking Device)
Data
AVD#
OE#
CLK
12
3
4
5
D0
D1
01
6
2
7
3
total number of clock cycles
following AVD# falling edge
Rising edge of next clock cycle
following last wait state triggers
next burst data
number of clock cycles
programmed
45
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| AM42BDS640AGBC9IT | 制造商:SPANSION 制造商全稱:SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
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