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參數(shù)資料
| 型號(hào)： | AM42BDS640AGBC9IS |
| 廠商： | SPANSION LLC |
| 元件分類(lèi)： | 存儲(chǔ)器 |
| 英文描述： | Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| 中文描述： | SPECIALTY MEMORY CIRCUIT, PBGA93 |
| 封裝： | 8 X 11.60 MM, FBGA-93 |
| 文件頁(yè)數(shù)： | 39/72頁(yè) |
| 文件大小： | 1064K |
| 代理商： | AM42BDS640AGBC9IS |
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November 1, 2002
Am42BDS640AG
43
P R E L I M INARY
AC CHARACTERISTICS
Notes:
1. Figure shows total number of wait states set to seven cycles. The total number of wait states can be programmed from two
cycles to seven cycles. Clock is set for active rising edge.
2. If any burst address occurs at a 64-word boundary, one additional clock cycle is inserted, and is indicated by RDY.
3. The device is in synchronous mode.
4. A17 = 1.
Figure 13.
Synchronous Burst Mode Read
Note: Figure assumes 7 wait states for initial access, 54 MHz clock, and automatic detect synchronous read. D0–D7 in data
waveform indicate the order of data within a given 8-word address range, from lowest to highest. Data will wrap around within
the 8 words non-stop unless the RESET# is asserted low, or AVD# latches in another address. Starting address in figure is the
7th address in range (A6). See “Requirements for Synchronous (Burst) Read Operation”. The Set Configuration Register
command sequence has been written with A18=1; device will output RDY with valid data.
Figure 14.
8-word Linear Burst with Wrap Around
Da
Da + 1
Da + n
OE#
DQ15-DQ0
A21-A0
Aa
AVD#
RDY
CLK
CE#
tCAS
tAAS
tAVC
tAVD
tAAH
tOE
tRACC
tOEZ
tCEZ
tIACC
tBDH
7 cycles for initial access shown.
Hi-Z
12
3
4
56
7
tRDYS
tBACC
tACC
f
D6
D7
OE#
DQ15-DQ0
A21-A0
Aa
AVD#
RDY
CLK
CE#f
tCES
tACS
tAVDS
tAVD
tACH
tOE
tIACC
tBDH
D0
D1
D5
D6
7 cycles for initial access shown.
18.5 ns typ. (54 MHz)
Hi-Z
tRACC
1
2
3
456
7
tRDYS
tBACC
t
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| AM42BDS640AGBC9IT | 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM42BDS640AGBD8IS | 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM42BDS640AGBD8IT | 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
| AM42BDS640AGBD9I | 制造商:Spansion 功能描述:COMBO 4MX16 FALSH + 1MX16 SRAM 1.8V 93FBGA - Trays |
| AM42BDS640AGBD9IS | 制造商:SPANSION 制造商全稱(chēng):SPANSION 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM |
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