參數(shù)資料
型號(hào): ADSP-BF535PKBZ-350
廠商: Analog Devices Inc
文件頁(yè)數(shù): 12/44頁(yè)
文件大?。?/td> 0K
描述: IC DSP CONTROLLER 16BIT 260-BGA
產(chǎn)品培訓(xùn)模塊: Blackfin® Processor Core Architecture Overview
Blackfin® Device Drivers
Blackfin® Optimizations for Performance and Power Consumption
Blackfin® System Services
標(biāo)準(zhǔn)包裝: 1
系列: Blackfin®
類型: 定點(diǎn)
接口: PCI,SPI,SSP,UART,USB
時(shí)鐘速率: 350MHz
非易失內(nèi)存: 外部
芯片上RAM: 308kB
電壓 - 輸入/輸出: 3.30V
電壓 - 核心: 1.60V
工作溫度: 0°C ~ 70°C
安裝類型: 表面貼裝
封裝/外殼: 260-BBGA
供應(yīng)商設(shè)備封裝: 260-PBGA(19x19)
包裝: 托盤
ADSP-BF535
–2–
REV. A
TABLE OF CONTENTS
GENERAL DESCRIPTION
The ADSP-BF535 processor is a member of the Blackfin
processor family of products, incorporating the Micro Signal
Architecture (MSA), jointly developed by Analog Devices, Inc.
and Intel Corporation. The architecture combines a dual MAC
state-of-the-art signal processing engine, the advantages of a
clean, orthogonal RISC-like microprocessor instruction set, and
Single-Instruction, Multiple Data (SIMD) multimedia capabili-
ties into a single instruction set architecture.
By integrating a rich set of industry leading system peripherals
and memory, Blackfin processors are the platform of choice for
next generation applications that require RISC-like programma-
bility, multimedia support, and leading edge signal processing in
one integrated package.
Portable Low Power Architecture
Blackfin processors provide world class power management and
performance. Blackfin processors are designed in a low power
and low voltage design methodology and feature dynamic power
management, the ability to independently vary both the voltage
and frequency of operation to significantly lower overall power
consumption. Varying the voltage and frequency can result in a
substantial reduction in power consumption, by comparison to
just varying the frequency of operation. This translates into
longer battery life for portable appliances.
System Integration
The ADSP-BF535 Blackfin processor is a highly integrated
system-on-a-chip solution for the next generation of digital com-
munication and portable Internet appliances. By combining
industry-standard interfaces with a high performance signal
processing core, users can develop cost-effective solutions
quickly without the need for costly external components. The
ADSP-BF535 Blackfin processor system peripherals include
UARTs, SPIs, SPORTs, general-purpose Timers, a Real-Time
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ADSP-BF536BBC-3A 功能描述:IC DSP CTLR 16BIT 182CSPBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - DSP(數(shù)字式信號(hào)處理器) 系列:Blackfin® 標(biāo)準(zhǔn)包裝:2 系列:StarCore 類型:SC140 內(nèi)核 接口:DSI,以太網(wǎng),RS-232 時(shí)鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:431-BFBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:431-FCPBGA(20x20) 包裝:托盤
ADSP-BF536BBC-4A 功能描述:IC DSP CTLR 16BIT 182CSPBGA RoHS:否 類別:集成電路 (IC) >> 嵌入式 - DSP(數(shù)字式信號(hào)處理器) 系列:Blackfin® 標(biāo)準(zhǔn)包裝:2 系列:StarCore 類型:SC140 內(nèi)核 接口:DSI,以太網(wǎng),RS-232 時(shí)鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:1.436MB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:-40°C ~ 105°C 安裝類型:表面貼裝 封裝/外殼:431-BFBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:431-FCPBGA(20x20) 包裝:托盤
ADSP-BF536BBCZ-3A 功能描述:IC DSP CTLR 16BIT 182CSPBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP(數(shù)字式信號(hào)處理器) 系列:Blackfin® 標(biāo)準(zhǔn)包裝:40 系列:TMS320DM64x, DaVinci™ 類型:定點(diǎn) 接口:I²C,McASP,McBSP 時(shí)鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:160kB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:0°C ~ 90°C 安裝類型:表面貼裝 封裝/外殼:548-BBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:548-FCBGA(27x27) 包裝:托盤 配用:TMDSDMK642-0E-ND - DEVELPER KIT W/NTSC CAMERA296-23038-ND - DSP STARTER KIT FOR TMS320C6416296-23059-ND - FLASHBURN PORTING KIT296-23058-ND - EVAL MODULE FOR DM642TMDSDMK642-ND - DEVELOPER KIT W/NTSC CAMERA
ADSP-BF536BBCZ-3AX 制造商:Analog Devices 功能描述:182-MBGA PB-FREE - Trays
ADSP-BF536BBCZ-3B 功能描述:IC DSP CTLR 16BIT 208CSPBGA RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP(數(shù)字式信號(hào)處理器) 系列:Blackfin® 標(biāo)準(zhǔn)包裝:40 系列:TMS320DM64x, DaVinci™ 類型:定點(diǎn) 接口:I²C,McASP,McBSP 時(shí)鐘速率:400MHz 非易失內(nèi)存:外部 芯片上RAM:160kB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:0°C ~ 90°C 安裝類型:表面貼裝 封裝/外殼:548-BBGA,F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:548-FCBGA(27x27) 包裝:托盤 配用:TMDSDMK642-0E-ND - DEVELPER KIT W/NTSC CAMERA296-23038-ND - DSP STARTER KIT FOR TMS320C6416296-23059-ND - FLASHBURN PORTING KIT296-23058-ND - EVAL MODULE FOR DM642TMDSDMK642-ND - DEVELOPER KIT W/NTSC CAMERA