參數(shù)資料
型號: AD9653-125EBZ
廠商: Analog Devices Inc
文件頁數(shù): 4/40頁
文件大?。?/td> 0K
描述: BOARD EVAL FOR AD9653
標(biāo)準(zhǔn)包裝: 1
ADC 的數(shù)量: 4
位數(shù): 16
采樣率(每秒): 125M
數(shù)據(jù)接口: LVDS,串行,SPI?
輸入范圍: 2 Vpp
在以下條件下的電源(標(biāo)準(zhǔn)): 673mW @ 125MSPS
工作溫度: -40°C ~ 85°C
已用 IC / 零件: AD9653
已供物品:
AD9653
Data Sheet
Rev. 0 | Page 12 of 40
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
Figure 6. 48-Lead LFCSP Pin Configuration, Top View
Table 10. Pin Function Descriptions
Pin No.
Mnemonic
Description
0
AGND,
Exposed Pad
Analog Ground, Exposed Pad. The exposed thermal pad on the bottom of the package provides the
analog ground for the part. This exposed pad must be connected to ground for proper operation.
1
VIN+D
ADC D Analog Input True.
2
VIND
ADC D Analog Input Complement.
3, 4, 7, 34, 39, 45, 46
AVDD
1.8 V Analog Supply Pins.
5, 6
CLK, CLK+
Differential Encode Clock. PECL, LVDS, or 1.8 V CMOS inputs.
8, 29
DRVDD
Digital Output Driver Supply.
9, 10
D1D, D1+D
Channel D Digital Outputs.
11, 12
D0D, D0+D
Channel D Digital Outputs.
13, 14
D1C, D1+C
Channel C Digital Outputs.
15, 16
D0C, D0+C
Channel C Digital Outputs.
17, 18
DCO, DCO+
Data Clock Outputs.
19, 20
FCO, FCO+
Frame Clock Outputs.
21, 22
D1B, D1+B
Channel B Digital Outputs.
23, 24
D0B, D0+B
Channel B Digital Outputs.
25, 26
D1A, D1+A
Channel A Digital Outputs.
27, 28
D0A, D0+A
Channel A Digital Outputs.
30
SCLK/DTP
SPI Clock Input/Digital Test Pattern.
31
SDIO/OLM
SPI Data Input and Output Bidirectional SPI Data/Output Lane Mode.
32
CSB
SPI Chip Select Bar. Active low enable; 30 kΩ internal pull-up.
33
PDWN
Digital Input, 30 kΩ Internal Pull-Down.
PDWN high = power-down device.
PDWN low = run device, normal operation.
35
VINA
ADC A Analog Input Complement.
36
VIN+A
ADC A Analog Input True.
37
VIN+B
ADC B Analog Input True.
38
VINB
ADC B Analog Input Complement.
40
RBIAS
Sets Analog Current Bias. Connect to 10 kΩ (1% tolerance) resistor to ground.
41
SENSE
Reference Mode Selection.
42
VREF
Voltage Reference Input and Output.
43
VCM
Analog Input Common-Mode Voltage.
1
2
3
VIN+A
VIN–A
AVDD
4
PDWN
5
CSB
6
SDIO/OLM
7
SCLK/DTP
24
D0+
B
23
D0–B
22
D1+
B
21
D1–B
20
FC
O+
19
FC
O–
18
DCO
+
17
DCO
16
D0+
C
15
D0–C
14
D1+
C
13
D1–C
44
SYN
C
45
A
V
DD
46
A
V
DD
47
V
IN–C
48
V
IN+
C
43
V
CM
42
VR
EF
41
SEN
SE
40
RBI
AS
39
A
V
DD
38
V
IN–B
37
V
IN+
B
25
D0+D
26
D0–D
27
D1+D
28
D1–D
29
DRVDD
30
AVDD
31
CLK+
32
CLK–
33
AVDD
34
AVDD
35
VIN–D
36
VIN+D
8
DRVDD
9
D0+A
10
D0–A
11
D1+A
12
D1–A
AD9653
TOP VIEW
(Not to Scale)
NOTES
1. THE EXPOSED THERMAL PAD ON THE BOTTOM OF THE
PACKAGE PROVIDES THE ANALOG GROUND FOR THE PART.
THIS EXPOSED PAD MUST BE CONNECTED TO GROUND FOR
PROPER OPERATION.
10538-
006
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