參數(shù)資料
型號： AD9653-125EBZ
廠商： Analog Devices Inc
文件頁數(shù)： 3/40頁
文件大?。?/td> 0K
描述： BOARD EVAL FOR AD9653
標準包裝： 1
ADC 的數(shù)量： 4
位數(shù)： 16
采樣率（每秒）： 125M
數(shù)據(jù)接口： LVDS，串行，SPI?
輸入范圍： 2 Vpp
在以下條件下的電源（標準）： 673mW @ 125MSPS
工作溫度： -40°C ~ 85°C
已用 IC / 零件： AD9653
已供物品： 板
Data Sheet
AD9653
Rev. 0 | Page 11 of 40
ABSOLUTE MAXIMUM RATINGS
Table 8.
Parameter
Rating
Electrical
AVDD to AGND
0.3 V to +2.0 V
DRVDD to AGND
0.3 V to +2.0 V
Digital Outputs
(D0±x, D1±x, DCO+, DCO, FCO+,
FCO) to AGND
0.3 V to +2.0 V
CLK+, CLK to AGND
0.3 V to +2.0 V
VIN+x, VINx to AGND
0.3 V to +2.0 V
SCLK/DTP, SDIO/OLM, CSB to AGND
0.3 V to +2.0 V
SYNC, PDWN to AGND
0.3 V to +2.0 V
RBIAS to AGND
0.3 V to +2.0 V
VREF, SENSE to AGND
0.3 V to +2.0 V
Environmental
Operating Temperature
Range (Ambient, V
REF = 1.0 V)
40°C to +85°C
Operating Temperature
Range (Ambient, V
REF = 1.3 V)
0°C to 85°C
Maximum Junction
Temperature
150°C
Lead Temperature
(Soldering, 10 sec)
300°C
Storage Temperature
Range (Ambient)
65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Table 9. Thermal Resistance
Package Type
Air Flow
Velocity
(m/sec)
θ
θ
JB
θ
JC
Unit
48-Lead LFCSP
0.0
23.7
7.8
7.1
°C/W
7 mm × 7 mm
1.0
20.0
N/A
°C/W
(CP-48-13)
2.5
18.7
N/A
°C/W
1 θ
JA for a 4-layer PCB with solid ground plane (simulated). Exposed pad
soldered to PCB.
ESD CAUTION
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