4-6 Revision 13 QN132 Note For Package Manufacturing and Environmental information, visit the Resource Center at ht" />
鍙冩暩(sh霉)璩囨枡
鍨嬭櫉(h脿o)锛� A3P125-1VQ100T
寤犲晢锛� Microsemi SoC
鏂囦欢闋佹暩(sh霉)锛� 38/220闋�
鏂囦欢澶�?銆�?/td> 0K
鎻忚堪锛� IC FPGA 1KB FLASH 125K 100-VQFP
妯�(bi膩o)婧�(zh菙n)鍖呰锛� 90
绯诲垪锛� ProASIC3
RAM 浣嶇附瑷�(j矛)锛� 36864
杓稿叆/杓稿嚭鏁�(sh霉)锛� 71
闁€鏁�(sh霉)锛� 125000
闆绘簮闆诲锛� 1.425 V ~ 1.575 V
瀹夎椤炲瀷锛� 琛ㄩ潰璨艰
宸ヤ綔婧害锛� -40°C ~ 125°C
灏佽/澶栨锛� 100-TQFP
渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁濓細 100-VQFP锛�14x14锛�
绗�1闋�绗�2闋�绗�3闋�绗�4闋�绗�5闋�绗�6闋�绗�7闋�绗�8闋�绗�9闋�绗�10闋�绗�11闋�绗�12闋�绗�13闋�绗�14闋�绗�15闋�绗�16闋�绗�17闋�绗�18闋�绗�19闋�绗�20闋�绗�21闋�绗�22闋�绗�23闋�绗�24闋�绗�25闋�绗�26闋�绗�27闋�绗�28闋�绗�29闋�绗�30闋�绗�31闋�绗�32闋�绗�33闋�绗�34闋�绗�35闋�绗�36闋�绗�37闋�鐣�(d膩ng)鍓嶇38闋�绗�39闋�绗�40闋�绗�41闋�绗�42闋�绗�43闋�绗�44闋�绗�45闋�绗�46闋�绗�47闋�绗�48闋�绗�49闋�绗�50闋�绗�51闋�绗�52闋�绗�53闋�绗�54闋�绗�55闋�绗�56闋�绗�57闋�绗�58闋�绗�59闋�绗�60闋�绗�61闋�绗�62闋�绗�63闋�绗�64闋�绗�65闋�绗�66闋�绗�67闋�绗�68闋�绗�69闋�绗�70闋�绗�71闋�绗�72闋�绗�73闋�绗�74闋�绗�75闋�绗�76闋�绗�77闋�绗�78闋�绗�79闋�绗�80闋�绗�81闋�绗�82闋�绗�83闋�绗�84闋�绗�85闋�绗�86闋�绗�87闋�绗�88闋�绗�89闋�绗�90闋�绗�91闋�绗�92闋�绗�93闋�绗�94闋�绗�95闋�绗�96闋�绗�97闋�绗�98闋�绗�99闋�绗�100闋�绗�101闋�绗�102闋�绗�103闋�绗�104闋�绗�105闋�绗�106闋�绗�107闋�绗�108闋�绗�109闋�绗�110闋�绗�111闋�绗�112闋�绗�113闋�绗�114闋�绗�115闋�绗�116闋�绗�117闋�绗�118闋�绗�119闋�绗�120闋�绗�121闋�绗�122闋�绗�123闋�绗�124闋�绗�125闋�绗�126闋�绗�127闋�绗�128闋�绗�129闋�绗�130闋�绗�131闋�绗�132闋�绗�133闋�绗�134闋�绗�135闋�绗�136闋�绗�137闋�绗�138闋�绗�139闋�绗�140闋�绗�141闋�绗�142闋�绗�143闋�绗�144闋�绗�145闋�绗�146闋�绗�147闋�绗�148闋�绗�149闋�绗�150闋�绗�151闋�绗�152闋�绗�153闋�绗�154闋�绗�155闋�绗�156闋�绗�157闋�绗�158闋�绗�159闋�绗�160闋�绗�161闋�绗�162闋�绗�163闋�绗�164闋�绗�165闋�绗�166闋�绗�167闋�绗�168闋�绗�169闋�绗�170闋�绗�171闋�绗�172闋�绗�173闋�绗�174闋�绗�175闋�绗�176闋�绗�177闋�绗�178闋�绗�179闋�绗�180闋�绗�181闋�绗�182闋�绗�183闋�绗�184闋�绗�185闋�绗�186闋�绗�187闋�绗�188闋�绗�189闋�绗�190闋�绗�191闋�绗�192闋�绗�193闋�绗�194闋�绗�195闋�绗�196闋�绗�197闋�绗�198闋�绗�199闋�绗�200闋�绗�201闋�绗�202闋�绗�203闋�绗�204闋�绗�205闋�绗�206闋�绗�207闋�绗�208闋�绗�209闋�绗�210闋�绗�211闋�绗�212闋�绗�213闋�绗�214闋�绗�215闋�绗�216闋�绗�217闋�绗�218闋�绗�219闋�绗�220闋�
Package Pin Assignments
4-6
Revision 13
QN132
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
Notes:
1. This is the bottom view of the package.
2. The die attach paddle center of the package is tied to ground (GND).
A37
A1
A12
A36
D4
D3
D1
D2
A25
A48
A24
A13
B34
B1
B11
B44
B22
B12
C31
C1
C10
B33
B23
C30
C21
C40
C20
C11
Optional
Corner Pad (4x)
Pin A1Mark
鐩搁棞(gu膩n)PDF璩囨枡
PDF鎻忚堪
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鐩搁棞(gu膩n)浠g悊鍟�/鎶€琛�(sh霉)鍙冩暩(sh霉)
鍙冩暩(sh霉)鎻忚堪
A3P125-1VQ144 鍒堕€犲晢:ACTEL 鍒堕€犲晢鍏ㄧū:Actel Corporation 鍔熻兘鎻忚堪:ProASIC3 Flash Family FPGAs
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A3P125-1VQ144I 鍒堕€犲晢:ACTEL 鍒堕€犲晢鍏ㄧū:Actel Corporation 鍔熻兘鎻忚堪:ProASIC3 Flash Family FPGAs
A3P125-1VQ144PP 鍒堕€犲晢:ACTEL 鍒堕€犲晢鍏ㄧū:Actel Corporation 鍔熻兘鎻忚堪:ProASIC3 Flash Family FPGAs
A3P125-1VQ144T 鍒堕€犲晢:ACTEL 鍒堕€犲晢鍏ㄧū:Actel Corporation 鍔熻兘鎻忚堪:Automotive ProASIC3 Flash Family FPGAs