參數(shù)資料
型號： UPD98401A
廠商： NEC Corp.
英文描述： ATM SAR CHIP
中文描述： 自動柜員機特區(qū)芯片
文件頁數(shù)： 6/36頁
文件大?。?/td> 216K
代理商： UPD98401A
Data Sheet S12100EJ3V0DS00
6
μ
PD98401A
CONTENTS
1. PIN FUNCTION .....................................................................................................................................7
1.1 PHY Device Interface Pin.............................................................................................................7
1.2 Bus Interface Pins ........................................................................................................................9
1.3 Bus Monitor Pins........................................................................................................................12
1.4 Control Memory Interface Pins..................................................................................................13
1.5 JTAG Boundary Scan Pins........................................................................................................14
1.6 Test Pin........................................................................................................................................14
1.7 Power Supply and Ground Pins................................................................................................14
1.8 Pin Status During and After Reset............................................................................................15
2. DIFFERENCES FROM
μ
PD98401....................................................................................................16
2.1 Additional Functions..................................................................................................................16
2.2 Differences from
μ
PD98401 (NEASCOT-S10
TM
)........................................................................16
3. ELECTRICAL SPECIFICATIONS......................................................................................................17
4. PACKAGE DRAWINGS......................................................................................................................33
5. RECOMMENDED SOLDERING CONDITIONS..................................................................................34
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