
83
PD780021A(A), 780022A(A), 780023A(A), 780024A(A), 780021AY(A), 780022AY(A), 780023AY(A), 780024AY(A)
Data Sheet U15131EJ3V0DS
Table 14-1. Surface Mounting Type Soldering Conditions (2/2)
(3)
PD780021AGK(A)-×××
×××
×××-9ET: 64-pin plastic TQFP (12 x 12)
PD780022AGK(A)-×××
×××
×××-9ET: 64-pin plastic TQFP (12 x 12)
PD780023AGK(A)-×××
×××
×××-9ET: 64-pin plastic TQFP (12 x 12)
PD780024AGK(A)-×××
×××
×××-9ET: 64-pin plastic TQFP (12 x 12)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°C, Time: 30 seconds max.
IR35-107-2
(at 210
°C or higher), Count: Two times or less, Exposure limit:
7 daysNote (after that, prebake at 125
°C for 10 hours)
VPS
Package peak temperature: 215
°C, Time: 40 seconds max.
VP15-107-2
(at 200
°C or higher), Count: Two times or less, Exposure limit:
7 daysNote (after that, prebake at 125
°C for 10 hours)
Wave soldering
Solder bath temperature: 260
°C max., Time: 10 seconds max.,
WS60-107-1
Count: Once, Preheating temperature: 120
°C Max. (package surface
temperature), Exposure limit: 7 daysNote (after that, prebake at 125
°C
for 10 hours)
Partial heating
Pin temperature: 300
°C max., Time: 3 seconds max. (per pin row)
—
Note
After opening the dry pack, store it at 25
°C or less and 65%RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
Table 14-2. Insertion Type Soldering Conditions
PD780021ACW(A)-×××
×××
×××: 64-pin plastic SDIP (19.05 mm (750))
PD780022ACW(A)-×××
×××
×××: 64-pin plastic SDIP (19.05 mm (750))
PD780023ACW(A)-×××
×××
×××: 64-pin plastic SDIP (19.05 mm (750))
PD780024ACW(A)-×××
×××
×××: 64-pin plastic SDIP (19.05 mm (750))
Soldering Method
Soldering Conditions
Wave soldering
Solder bath temperature: 260
°C max., Time: 10 seconds max.
(only for pins)
Partial heating
Pin temperature: 300
°C max., Time: 3 seconds max. (per pin row)
Caution Apply wave soldering only to the pins and be careful not to bring solder into direct contact with
the package.