參數(shù)資料
型號(hào)： UPD780023AYCW(A)-XXX
元件分類： 微控制器/微處理器
英文描述： 8-BIT, MROM, 12 MHz, MICROCONTROLLER, PDIP64
封裝： 0.750 INCH, PLASTIC, SDIP-64
文件頁數(shù)： 81/92頁
文件大小： 689K
代理商： UPD780023AYCW(A)-XXX
82
PD780021A(A), 780022A(A), 780023A(A), 780024A(A), 780021AY(A), 780022AY(A), 780023AY(A), 780024AY(A)
Data Sheet U15131EJ3V0DS
14. RECOMMENDED SOLDERING CONDITIONS
The
PD780021A(A), 780022A(A), 780023A(A), and 780024A(A)Note should be soldered and mounted under the
following recommended conditions.
For details of the recommended soldering conditions, refer to the document Semiconductor Device Mounting
Technology Manual (C10535E).
For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales
representative.
Note
The
PD780021AY(A), 780022AY(A) (except for the 64-pin plastic QFP (GC-AB8 type)), 780023AY(A),
and 780024AY(A) and the 64-pin plastic LQFP (GB-8EU type) of the
PD780021A(A), 780022A(A),
780023A(A), and 780024A(A) are under development, so their soldering conditions are undetermined.
Table 14-1. Surface Mounting Type Soldering Conditions (1/2)
(1)
PD780021AGC(A)-×××
×××
×××-AB8: 64-pin plastic QFP (14 x 14)
PD780022AGC(A)-×××
×××
×××-AB8: 64-pin plastic QFP (14 x 14)
PD780023AGC(A)-×××
×××
×××-AB8: 64-pin plastic QFP (14 x 14)
PD780024AGC(A)-×××
×××
×××-AB8: 64-pin plastic QFP (14 x 14)
PD780022AYGC(A)-×××
×××
×××-AB8: 64-pin plastic QFP (14 x 14)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°C, Time: 30 seconds max.
IR35-00-3
(at 210
°C or higher), Count: Three times or less
VPS
Package peak temperature: 215
°C, Time: 40 seconds max.
VP15-00-3
(at 200
°C or higher), Count: Three times or less
Wave soldering
Solder bath temperature: 260
°C max., Time: 10 seconds max.,
WS60-00-1
Count: Once, Preheating temperature: 120
°C Max. (package surface
temperature)
Partial heating
Pin temperature: 300
°C max., Time: 3 seconds max. (per pin row)
–
Caution
Do not use different soldering methods together (except for partial heating).
(2)
PD780021AGC(A)-×××
×××
×××-8BS: 64-pin plastic LQFP (14 x 14)
PD780022AGC(A)-×××
×××
×××-8BS: 64-pin plastic LQFP (14 x 14)
PD780023AGC(A)-×××
×××
×××-8BS: 64-pin plastic LQFP (14 x 14)
PD780024AGC(A)-×××
×××
×××-8BS: 64-pin plastic LQFP (14 x 14)
Soldering Method
Soldering Conditions
Recommended
Condition Symbol
Infrared reflow
Package peak temperature: 235
°C, Time: 30 seconds max.
IR35-00-2
(at 210
°C or higher), Count: Two times or less
VPS
Package peak temperature: 215
°C, Time: 40 seconds max.
VP15-00-2
(at 200
°C or higher), Count: Two times or less
Wave soldering
Solder bath temperature: 260
°C max., Time: 10 seconds max.,
WS60-00-1
Count: Once, Preheating temperature: 120
°C Max. (package surface
temperature)
Partial heating
Pin temperature: 300
°C max., Time: 3 seconds max. (per pin row)
–
Caution
Do not use different soldering methods together (except for partial heating).
相關(guān)PDF資料
PDF描述
UPD780032AGC-XXX-8BS-A 8-BIT, MROM, 12 MHz, MICROCONTROLLER, PQFP64
UPD78F0034BGB-8EU-A 8-BIT, FLASH, 12 MHz, MICROCONTROLLER, PQFP64
UPD780134GB-XXX-8EU 8-BIT, MROM, 10 MHz, MICROCONTROLLER, PQFP64
UPD780134GC-XXX-8BS 8-BIT, MROM, 10 MHz, MICROCONTROLLER, PQFP64
UPD780308GF(A)-XXX-3BA 8-BIT, MROM, 5 MHz, MICROCONTROLLER, PQFP100
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
UPD780024AGK-C42-9ET 制造商:Renesas Electronics Corporation 功能描述:
UPD780024AGK-C93-9ET 制造商:Renesas Electronics Corporation 功能描述:
UPD780033AGK-B03-9ET 制造商:Renesas Electronics Corporation 功能描述:
UPD780033AGK-B03-9ET-A 制造商:Renesas Electronics Corporation 功能描述:
UPD780034AGC-119-8BS-A 制造商:Renesas Electronics Corporation 功能描述:NECUPD780034AGC-119-8BS-A MCU
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