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參數(shù)資料
| 型號(hào)： | TVP5160PNPG4 |
| 廠商： | TEXAS INSTRUMENTS INC |
| 元件分類： | 顏色信號(hào)轉(zhuǎn)換 |
| 英文描述： | COLOR SIGNAL DECODER, PQFP128 |
| 封裝： | PLASTIC, HTQFP-128 |
| 文件頁數(shù)： | 20/119頁 |
| 文件大?。?/td> | 1347K |
| 代理商： | TVP5160PNPG4 |
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Designing with PowerPAD
105
February 2005 Revised April 2006
SLES135A
8
Designing with PowerPAD
The TVP5160 device is housed in a high-performance, thermally enhanced, 128-pin PowerPADTM package
(TI package designator: 128PFP). Use of the PowerPADTM package does not require any special
considerations except to note that the PowerPADTM, which is an exposed die pad on the bottom of the device,
is a metallic thermal and electrical conductor. Therefore, if not implementing the PowerPADTM PCB features,
the use of solder masks (or other assembly techniques) may be required to prevent any inadvertent shorting
by the exposed PowerPADTM of connection etches or vias under the package. The recommended option,
however, is not to run any etches or signal vias under the device, but to have only a grounded thermal land
as explained below. Although the actual size of the exposed die pad may vary, the minimum size required for
the keep out area for the 128-terminal PFP PowerPAD package is 8.8 mm x 8.8 mm and is centered on the
device package.
It is recommended that there be a thermal land, which is an area of solder-tinned-copper, underneath the
PowerPADTM package. The thermal land will vary in size, depending on the PowerPADTM package being
used, the PCB construction, and the amount of heat that needs to be removed. In addition, the thermal land
may or may not contain numerous thermal vias depending on PCB construction.
Other requirements for thermal lands and thermal vias are detailed in the TI application note PowerPADTM
Thermally Enhanced Package Application Report, TI literature number SLMA002, available via the TI Web
pages beginning at URL: http://www.ti.com
For the TVP5160 device, this thermal land must be grounded to the low impedance ground plane of the device.
This improves not only thermal performance but also the electrical grounding of the device. It is also
recommended that the device ground terminal landing pads be connected directly to the grounded thermal
land. The land size must be as large as possible without shorting device signal terminals. The thermal land
may be soldered to the exposed PowerPADTM using standard reflow soldering techniques.
While the thermal land may be electrically floated and configured to remove heat to an external heat sink, it
is recommended that the thermal land be connected to the low impedance ground plane for the device. More
information may be obtained from the TI application note PHY Layout, TI literature number SLLA020.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| TVP5160PNP | COLOR SIGNAL DECODER, PQFP128 |
| TVP5200PZP | SPECIALTY CONSUMER CIRCUIT, PQFP100 |
| TVP6000CPFP | COLOR SIGNAL ENCODER, PQFP80 |
| TVP7000PZPG4 | SPECIALTY CONSUMER CIRCUIT, PQFP100 |
| TVP7000PZPRG4 | SPECIALTY CONSUMER CIRCUIT, PQFP100 |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| TVP6000C | 制造商:TI 制造商全稱:Texas Instruments 功能描述:NTSC/PAL Digital Video Encoder |
| TVP6000CPFP | 功能描述:接口—CODEC NTSC / PAL VIDEO ENCODER RoHS:否 制造商:Texas Instruments 類型: 分辨率: 轉(zhuǎn)換速率:48 kSPs 接口類型:I2C ADC 數(shù)量:2 DAC 數(shù)量:4 工作電源電壓:1.8 V, 2.1 V, 2.3 V to 5.5 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:DSBGA-81 封裝:Reel |
| TVP7000 | 制造商:Texas Instruments 功能描述:Triple 8-bit Digitizer 150MSPS TVP7000 |
| TVP7000EVM | 功能描述:視頻 IC 開發(fā)工具 TVP7000 Eval Mod RoHS:否 制造商:Texas Instruments 產(chǎn)品:Evaluation Boards 類型:YPbPr to RGBHV Converters 工具用于評(píng)估:LMH1251 工作電源電壓:5 V |
| TVP7000PZP | 功能描述:視頻模擬/數(shù)字化轉(zhuǎn)換器集成電路 Triple 8/10B 150/110 MSPS Video ADC RoHS:否 制造商:Texas Instruments 輸入信號(hào)類型:Differential 轉(zhuǎn)換器數(shù)量:1 ADC 輸入端數(shù)量:4 轉(zhuǎn)換速率:3 Gbps 分辨率:8 bit 結(jié)構(gòu): 輸入電壓:3.3 V 接口類型:SPI 信噪比: 電壓參考: 電源電壓-最大:3.45 V 電源電壓-最小:3.15 V 最大功率耗散: 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:TCSP-48 封裝:Reel |
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