參數(shù)資料
型號： TMX320C6414TGLZ
廠商： Texas Instruments, Inc.
元件分類： 數(shù)字信號處理
英文描述： FIXED-POINT DIGITAL SIGNAL PROCESSORS
中文描述： 定點數(shù)字信號處理器
文件頁數(shù)： 134/140頁
文件大?。?/td> 2033K
代理商： TMX320C6414TGLZ
SPRS226H NOVEMBER 2003 REVISED AUGUST 2005
134
POST OFFICE BOX 1443
HOUSTON, TEXAS 772511443
MECHANICAL DATA FOR C6414T, C6415T, AND C6416T
The following table(s) show the thermal resistance characteristics for the PBGA — GLZ and ZLZ mechanical
packages.
thermal resistance characteristics (S-PBGA package) [GLZ]
NO.
Air Flow (m/s)
°
C/W
°
C/W
(with Heat Sink
§
)
1
R
Θ
JC
R
Θ
JB
R
Θ
JA
R
Θ
JA
R
Θ
JA
R
Θ
JA
PsiJT
PsiJB
Junction-to-case
N/A
3.11
3.11
2
Junction-to-board
N/A
9.95
9.95
3
Junction-to-free air
0.00
19.6
14.4
4
Junction-to-free air
0.5
17.3
11.5
5
Junction-to-free air
1.0
15.6
9.3
6
Junction-to-free air
2.00
14.7
8.0
7
Junction-to-package top
N/A
0.83
0.83
8
Junction-to-board
N/A
7.88
7.88
m/s = meters per second
Numbers are based on simulations.
§These thermal resistance numbers were modeled using a heat sink, part number 374024B00035, manufactured by AAVID Thermalloy. AAVID
Thermalloy also manufactures a similar epoxy-mounted heat sink, part number 374024B00000.
When operating at 1 GHz, a heat sink is
required to reduce the thermal resistance characteristics of the package.
TI recommends a passive, laminar heat sink, similar to the part
numbers mentioned above.
thermal resistance characteristics (S-PBGA package) [ZLZ]
NO.
Air Flow (m/s)
°
C/W
°
C/W
(with Heat Sink
§
)
1
R
Θ
JC
R
Θ
JB
R
Θ
JA
R
Θ
JA
R
Θ
JA
R
Θ
JA
PsiJT
PsiJB
Junction-to-case
N/A
3.11
3.11
2
Junction-to-board
N/A
9.95
9.95
3
Junction-to-free air
0.00
19.6
14.4
4
Junction-to-free air
0.5
17.3
11.5
5
Junction-to-free air
1.0
15.6
9.3
6
Junction-to-free air
2.00
14.7
8.0
7
Junction-to-package top
N/A
0.83
0.83
8
Junction-to-board
N/A
7.88
7.88
m/s = meters per second
Numbers are based on simulations.
§These thermal resistance numbers were modeled using a heat sink, part number 374024B00035, manufactured by AAVID Thermalloy. AAVID
Thermalloy also manufactures a similar epoxy-mounted heat sink, part number 374024B00000.
When operating at 1 GHz, a heat sink is
required to reduce the thermal resistance characteristics of the package.
TI recommends a passive, laminar heat sink, similar to the part
numbers mentioned above.
相關PDF資料
PDF描述
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相關代理商/技術參數(shù)
參數(shù)描述
TMX320C6414TGLZ1 制造商:TI 制造商全稱:Texas Instruments 功能描述:FIXED-POINT DIGITAL SIGNAL PROCESSORS
TMX320C6415CGLZ 制造商:Rochester Electronics LLC 功能描述:- Bulk
TMX320C6415CGLZ300 制造商:TI 制造商全稱:Texas Instruments 功能描述:FIXED-POINT DIGITAL SIGNAL PROCESSORS
TMX320C6415CGLZ5E0 制造商:TI 制造商全稱:Texas Instruments 功能描述:FIXED-POINT DIGITAL SIGNAL PROCESSORS
TMX320C6415CGLZA300 制造商:TI 制造商全稱:Texas Instruments 功能描述:FIXED-POINT DIGITAL SIGNAL PROCESSORS
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