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參數(shù)資料
| 型號： | ST7LNB0V2Y0M6 |
| 廠商： | STMICROELECTRONICS |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 8-BIT, 8 MHz, MICROCONTROLLER, PDSO16 |
| 封裝： | 0.150 INCH, PLASTIC, SOP-16 |
| 文件頁數(shù)： | 19/30頁 |
| 文件大?。?/td> | 451K |
| 代理商： | ST7LNB0V2Y0M6 |
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Package characteristics
ST7LNB0V2Y0
7.2
Thermal characteristics
7.3
Soldering information
In order to meet environmental requirements, ST offers the ST7LNB0V2Y0 in ECOPACK
package. The package have a Lead-free second level interconnect. The category of second
Level Interconnect is marked on the package and on the inner box label, in compliance with
JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at www.st.com,
together with specific technical application notes covering the main technical aspects
related to lead-free conversion (AN2033, AN2034, AN2035, AN2036).
Backward and forward compatibility
The main difference between Pb and Pb-free soldering process is the temperature range.
●
ECOPACK LQFP, SDIP, SO and QFN20 packages are fully compatible with Lead (Pb)
containing soldering process (see application note AN2034)
●
TQFP, SDIP and SO Pb-packages are compatible with Lead-free soldering process,
nevertheless it's the customer's duty to verify that the Pb-packages maximum
temperature (mentioned on the Inner box label) is compatible with their Lead-free
soldering temperature.
)
Table 25.
Thermal characteristics
Symbol
Ratings
Value
Unit
RthJA
Package thermal resistance (junction to ambient)
85
°C/W
TJmax
Maximum junction temperature(1)
1.
The maximum chip-junction temperature is based on technology characteristics.
150
°C
PDmax
Power dissipation(2)
2.
The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA.
The power dissipation of an application can be defined by the user with the formula: PD=PINT+PPORT
where PINT is the chip internal power (IDDxVDD) and PPORT is the port power dissipation depending on the
ports used in the application.
300
mW
Table 26.
Soldering compatibility (wave and reflow soldering process)
Package
Plating material devices
Pb solder paste
Pb-free solder paste
SDIP & PDIP
Sn (pure Tin)
Yes
Yes(1)
1.
Assemblers must verify that the Pb-package maximum temperature (mentioned on the Inner box label) is
compatible with their Lead-free soldering process.
QFN
Sn (pure Tin)
Yes
Yes(1)
LQFP and SO
NiPdAu (Nickel-palladium-Gold)
Yes
Yes(1)
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| ST7LNB0V2Y0M6TR | 制造商:STMicroelectronics 功能描述: |
| ST7LNB0Y0M6 | 制造商:STMicroelectronics 功能描述: |
| ST7LNB0Y0M6TR | 制造商:STMicroelectronics 功能描述: |
| ST7LNB1Y0 | 制造商:STMICROELECTRONICS 制造商全稱:STMicroelectronics 功能描述:DiSEqC? slave microcontroller for SaTCR based LNBs and switchers |
| ST7LNB1Y0M6 | 制造商:STMicroelectronics 功能描述: 制造商:STMicroelectronics 功能描述:8-bits MCU, 1.5KB flash, 128B ram |
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