參數(shù)資料
型號: ST7FLIT19BF1U6TR
廠商: STMICROELECTRONICS
元件分類: 微控制器/微處理器
英文描述: 8-BIT, FLASH, 8 MHz, MICROCONTROLLER, QCC20
封裝: LEAD FREE, QFN-20
文件頁數(shù): 51/153頁
文件大小: 2862K
代理商: ST7FLIT19BF1U6TR
ST7LITE1xB
144/153
14.2 SOLDERING INFORMATION
In accordance with the RoHS European directive,
all STMicroelectronics packages have been con-
verted to lead-free technology, named ECO-
PACKTM.
ECOPACK
TM packages are qualified according
to the JEDEC STD-020C compliant soldering
profile.
Detailed information on the STMicroelectronics
ECOPACKTM transition program is available on
www.st.com/stonline/leadfree/,
with
specific
technical Application notes covering the main
technical
aspects
related
to
lead-free
conversion
(AN2033,
AN2034,
AN2035,
AN2036).
Backward and forward compatibility:
The main difference between Pb and Pb-free sol-
dering process is the temperature range.
– ECOPACKTM TQFP, SDIP, SO and QFN20
packages are fully compatible with Lead (Pb)
containing soldering process (see application
note AN2034)
– TQFP, SDIP and SO Pb-packages are compati-
ble with Lead-free soldering process, neverthe-
less it's the customer's duty to verify that the Pb-
packages maximum temperature (mentioned on
the Inner box label) is compatible with their Lead-
free soldering temperature.
Table 25. Soldering Compatibility (wave and reflow soldering process)
* Assemblers must verify that the Pb-package maximum temperature (mentioned on the Inner box label)
is compatible with their Lead-free soldering process.
Package
Plating material devices
Pb solder paste
Pb-free solder paste
SDIP & PDIP
Sn (pure Tin)
Yes
Yes *
QFN
Sn (pure Tin)
Yes
Yes *
TQFP and SO
NiPdAu (Nickel-palladium-Gold)
Yes
Yes *
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