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參數(shù)資料
| 型號： | SST89E54RC-33-C-PIE |
| 廠商： | Microchip Technology |
| 文件頁數(shù)： | 51/71頁 |
| 文件大小： | 0K |
| 描述： | IC MCU 8BIT 17KB FLASH 40PDIP |
| 標準包裝： | 9 |
| 系列： | FlashFlex® |
| 核心處理器： | 8051 |
| 芯體尺寸： | 8-位 |
| 速度： | 33MHz |
| 連通性： | EBI/EMI，UART/USART |
| 外圍設備： | POR，WDT |
| 輸入/輸出數(shù)： | 32 |
| 程序存儲器容量： | 16KB（16K x 8） |
| 程序存儲器類型： | 閃存 |
| EEPROM 大?。?/td> | 1K x 8 |
| RAM 容量： | 512 x 8 |
| 電壓 - 電源 (Vcc/Vdd)： | 4.5 V ~ 5.5 V |
| 振蕩器型： | 外部 |
| 工作溫度： | 0°C ~ 70°C |
| 封裝/外殼： | 40-DIP（0.600"，15.24mm） |
| 包裝： | 管件 |
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2011 Silicon Storage Technology, Inc.
DS25088A
10/11
55
FlashFlex MCU
SST89E52RC / SST89E54RC
Data Sheet
A Microchip Technology Company
Electrical Specification
Note: This specification contains preliminary information on new products in production.
The specifications are subject to change without notice.
Absolute Maximum Stress Ratings (Applied conditions greater than those listed under “Absolute
Maximum Stress Ratings” may cause permanent damage to the device. This is a stress rating only and
functional operation of the device at these conditions or conditions greater than those defined in the
operational sections of this data sheet is not implied. Exposure to absolute maximum stress rating con-
ditions may affect device reliability.)
Ambient Temperature Under Bias ...................................... -55°C to +125°C
Storage Temperature................................................. -65°C to +150°C
Voltage on EA# Pin to VSS.............................................. -0.5V to +14.0V
D.C. Voltage on Any Pin to Ground Potential ............................. -0.5V to VDD+0.5V
Transient Voltage (<20ns) on Any Other Pin to VSS ........................ -1.0V to VDD+1.0V
Maximum IOL per I/O Pins P1.5, P1.6, P1.7 ........................................ 20mA
Maximum IOL per I/O for All Other Pins ............................................ 15mA
Package Power Dissipation Capability (TA = 25°C)................................... 1.5W
Through Hole Lead Soldering Temperature (10 Seconds) ............................ 300°C
Surface Mount Solder Reflow Temperature1 ........................... 260°C for 10 seconds
1. Excluding certain with-Pb 32-PLCC units, all packages are 260
°C capable in both non-Pb and with-Pb solder versions.
Certain with-Pb 32-PLCC package types are capable of 240
°C for 10 seconds; please consult the factory for the latest information.
Output Short Circuit Current2 .................................................. 50mA
2. Outputs shorted for no more than one second. No more than one output shorted at a time.
(Based on package heat transfer limitations, not device power consumption.
Table 22:Operating Range
Symbol
Description
Min.
Max
Unit
TA
Ambient Temperature Under Bias
Standard
0
+70
°C
VDD
Supply Voltage
SST89E5xRC
4.5
5.5
V
fOSC
Oscillator Frequency
SST89E5xRC
0
33
MHz
Oscillator Frequency for In-Application pro-
gramming
SST89E5xRC
.25
33
MHz
T0-0.1 25008
Table 23:Reliability Characteristics
Symbol
Parameter
Minimum Specification
Units
Test Method
NEND1
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
Endurance
10,000
Cycles
JEDEC Standard A117
TDR1
Data Retention
100
Years
JEDEC Standard A103
ILTH1
Latch Up
100 + IDD
mA
JEDEC Standard 78
T0-0.0 25008
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