參數(shù)資料
型號： SPAK56F802TA60
廠商： MOTOROLA INC
元件分類： 數(shù)字信號處理
英文描述： 0-BIT, 60 MHz, OTHER DSP, PQFP32
封裝： 7 X 7 MM, 0.80 MM PITCH, 1.40 MM HEIGHT, PLASTIC, LQFP-32
文件頁數(shù)： 4/39頁
文件大?。?/td> 573K
代理商： SPAK56F802TA60
12
56F802 Technical Data
MOTOROLA
Notes:
1.
Theta-JA determined on 2s2p test boards is frequently lower than would be observed in an application.
Determined on 2s2p thermal test board.
2.
Junction to ambient thermal resistance, Theta-JA (RθJA) was simulated to be equivalent to the
JEDEC specification JESD51-2 in a horizontal configuration in natural convection. Theta-JA was
also simulated on a thermal test board with two internal planes (2s2p where s is the number of signal
layers and p is the number of planes) per JESD51-6 and JESD51-7. The correct name for Theta-JA
for forced convection or with the non-single layer boards is Theta-JMA.
3.
Junction to case thermal resistance, Theta-JC (RθJC ), was simulated to be equivalent to the measured
values using the cold plate technique with the cold plate temperature used as the "case" temperature.
The basic cold plate measurement technique is described by MIL-STD 883D, Method 1012.1. This
is the correct thermal metric to use to calculate thermal performance when the package is being used
with a heat sink.
4.
Thermal Characterization Parameter, Psi-JT (
Ψ
JT ), is the "resistance" from junction to reference
point thermocouple on top center of case as defined in JESD51-2.
Ψ
JT is a useful value to use to
estimate junction temperature in steady state customer environments.
Table 13. Recommended Operating Conditions
Characteristic
Symbol
Min
Typ
Max
Unit
Supply voltage, digital
VDD
3.0
3.3
3.6
V
Supply Voltage, analog
VDDA
3.0
3.3
3.6
V
ADC reference voltage
VREF
2.7
–
VDDA
V
Ambient operating temperature
TA
–40
–
85
°C
Table 14. Thermal Characteristics6
Characteristic
Comments
Symbol
Value
Unit
Note
s
32-pin LQFP
Junction to ambient
Natural convection
RθJA
50.2
°C/W
2
Junction to ambient (@1m/sec)
RθJMA
47.1
°C/W
2
Junction to ambient
Natural convection
Four layer board (2s2p)
RθJMA
(2s2p)
38.7
°C/W
1,2
Junction to ambient (@1m/sec)
Four layer board (2s2p)
RθJMA
37.4
°C/W
1,2
Junction to case
RθJC
17.8
°C/W
3
Junction to center of case
Ψ
JT
3.07
°C/W
4
I/O pin power dissipation
P I/O
User Determined
W
Power dissipation
P D
P D = (IDD x VDD + P I/O)W
Junction to center of case
PDMAX
(TJ - TA) /
θJA
°C
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