
11
Revision 1/.ebruary 8, 2001
www.semtech.com
HIGH-PER.ORMANCE PRODUCTS
SK12430
ADVANCED
–L–
–M
–
–N–
28
1
V
W
Y BRK
D
+
Z
X
U
B
0.007
(0.180)
T
L-
M
N
S
0.007
(0.180)
T
L-
M
N
M
S
M
S
G1
0.010
(0.250)
T
L-
M
N
S
Z
0.007 (0.180)
T
L – M
N
S
0.007 (0.180)
T
L – M
N
M
S
J
A
R
E
C
G1
G
0.004 (0.100)
–T–
SEATING PLANE
VIEW S
0.010 (0.250)
T
L – M
N
S
M
++
+
S
K
K1
H
F
0.007 (0.180)
T L – M
N
M
S
0.007(0.180)
T
L – M
N
M
S
28 Pin PLCC Package
Package Information
NOTES:
1.
Datums -L-, -M-, and -N- determined where top of lead
shoulder exits plastic body at mold parting line.
2.
DIM G1, true position to be measured at Datum -T-, Seating
Plane.
3.
DIM R and U do not include mold flash. Allowable mold flash
is 0.010 (0.250) per side.
4.
Dimensioning and tolerancing per ANSI Y14.5M, 982.
5.
Controlling Dimension:
Inch.
6.
The package top may be smaller than the package bottom by
up to 0.012 (0.300). Dimensions R and U are determined at
the outermost extremes of the plastic body exclusive of mold
flash, tie bar burrs, gate burrs and interlead flash, but
including any mismatch between the top and bottom of the
plastic body.
7.
Dimension H does not include Dambar protrusion or
intrusion. The Dambar protrusion(s) shall not cause the H
dimension to be greater than 0.037 (0.940). The Dambar
ntrusion(s) shall not cause the H dimension to be smaller
than 0.025 (0.635).
M
I
DN
I
MX
A
MN
I
MX
A
M
A5
8
4
.
05
9
4
.
02
3
.
2
17
5
.
2
1
B5
8
4
.
05
9
4
.
02
3
.
2
17
5
.
2
1
C5
6
1
.
00
8
1
.
00
2
.
47
5
.
4
E0
9
0
.
00
1
.
09
2
.
29
7
.
2
.3
1
0
.
09
1
0
.
03
3
.
08
4
.
0
G0
5
0
.
0C
S
B7
2
.
1C
S
B
H6
2
0
.
02
3
0
.
06
6
.
01
8
.
0
J0
2
0
.
0--1
5
.
0--
K5
2
0
.
0--4
6
.
0--
R0
5
4
.
06
5
4
.
03
4
.
1
18
5
.
1
U0
5
4
.
06
5
4
.
03
4
.
1
18
5
.
1
V2
4
0
.
08
4
0
.
07
0
.
11
2
.
1
W2
4
0
.
08
4
0
.
07
0
.
11
2
.
1
X2
4
0
.
06
5
0
.
07
0
.
12
4
.
1
Y--0
2
0
.
0--0
5
.
0
Z2o
0
1 o
2o
0
1 o
1
G0
1
4
.
00
3
4
.
02
4
.
0
12
9
.
0
1
K0
4
0
.
0--2
0
.
1--
MILLIMETERS
INCHES