參數(shù)資料
型號(hào): SE97BTP,547
廠商: NXP Semiconductors
文件頁(yè)數(shù): 36/53頁(yè)
文件大?。?/td> 386K
描述: IC TEMP SENSOR DIMM 8HWSON
產(chǎn)品培訓(xùn)模塊: I²C Bus Fundamentals
特色產(chǎn)品: NXP - I2C Interface
標(biāo)準(zhǔn)包裝: 1
功能: 溫度監(jiān)控系統(tǒng)(傳感器),DIMM DDR 內(nèi)存
傳感器類型: 內(nèi)部
感應(yīng)溫度: -40°C ~ 125°C
精確度: ±3°C(最小值)
拓?fù)洌?/td> ADC(三角積分型),比較器,寄存器庫(kù)
輸出類型: I²C?/SMBus?
輸出警報(bào):
輸出風(fēng)扇:
電源電壓: 3 V ~ 3.6 V
工作溫度: -40°C ~ 125°C
安裝類型: 表面貼裝
封裝/外殼: 8-WFDFN 裸露焊盤
供應(yīng)商設(shè)備封裝: 8-WSON
包裝: 標(biāo)準(zhǔn)包裝
產(chǎn)品目錄頁(yè)面: 847 (CN2011-ZH PDF)
其它名稱: 568-5055-6
SE97B_1
?NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 01  27 January 2010
36 of 53
NXP Semiconductors
SE97B
DDR memory module temp sensor with integrated SPD
9.1   SE97B in memory module application
Figure 21
 shows the SE97B being placed in the memory module application. The SE97B
is centered in the memory module to monitor the temperature of the DRAM and also to
provide a 2-kbit EEPROM as the Serial Presence Detect (SPD). In the event of
overheating, the SE97B triggers the EVENT
 output and the memory controller throttles
the memory bus to slow the DRAM. The memory controller can also read the SE97B and
watch the DRAM thermal behavior, taking preventive measures when necessary.
 
9.2   Layout consideration
The SE97B does not require any additional components other than the host controller to
read its temperature. It is recommended that a 0.1 糉 bypass capacitor between the V
DD
 
and V
SS
 pins is located as close as possible to the power and ground pins for noise
protection.
9.3   Thermal considerations
In general, self-heating is the result of power consumption and not a concern, especially
with the SE97B, which consumes very low power. In the event the SDA and EVENT
 pins
are heavily loaded with small pull-up resistor values, self-heating affects temperature
accuracy by approximately 0.5 癈.
Equation 1
 is the formula to calculate the effect of self-heating:
(1)
where:
擳 = T
j
 T
amb
T
j
 = junction temperature
T
amb
 = ambient temperature
R
th(j-a)
 = package thermal resistance
V
DD
 = supply voltage
I
DD(AV)
 = average supply current
Fig 21.   System application
002aae31
SE97B
EVENT
DIMM
DRAM
DRAM
DRAM
DRAM
MEMORY CONTROLLER
SMBus
CPU
?SPAN class="pst SE97BTP-547_2318313_14">T   R
th j-a
(    )
V
DD
I
DD AV
(    )
?/DIV>
(
)    V
OL SDA
(
)
I
OL
k
sin
(
) SDA
(
)
?/DIV>
(
)    V
OL EVENT
(
)
I
OL
k
sin
(
)EVENT
?/DIV>
(
)
+
+
[
]
?/DIV>
=
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