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| 型號： | SC18IS600IBS,151 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 總線控制器 |
| 英文描述： | I2C BUS CONTROLLER, PQCC24 |
| 封裝： | 4 X 4 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT616-3, HVQFN-24 |
| 文件頁數(shù)： | 19/30頁 |
| 文件大?。?/td> | 164K |
| 代理商： | SC18IS600IBS,151 |
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SC18IS600_601_5
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 05 — 28 July 2008
26 of 30
NXP Semiconductors
SC18IS600/601
SPI to I2C-bus interface
11.4 Reow soldering
Key characteristics in reow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reow process usually leads to
higher minimum peak temperatures (see Figure 30) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reow temperature prole; this prole includes preheat, reow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classied in accordance with
Table 15 and 16
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reow
soldering, see Figure 30.
Table 15.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
Table 16.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reow temperature (
°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
1.6 to 2.5
260
250
245
> 2.5
250
245
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| SC18IS600IPW | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:SPI to IC-bus interface |
| SC18IS600IPW,112 | 功能描述:總線收發(fā)器 INTERFACE SPI/I2C RoHS:否 制造商:Fairchild Semiconductor 邏輯類型:CMOS 邏輯系列:74VCX 每芯片的通道數(shù)量:16 輸入電平:CMOS 輸出電平:CMOS 輸出類型:3-State 高電平輸出電流:- 24 mA 低電平輸出電流:24 mA 傳播延遲時間:6.2 ns 電源電壓-最大:2.7 V, 3.6 V 電源電壓-最小:1.65 V, 2.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-48 封裝:Reel |
| SC18IS600IPW,128 | 功能描述:總線收發(fā)器 SPI-I2C MSTER BRIDGE RoHS:否 制造商:Fairchild Semiconductor 邏輯類型:CMOS 邏輯系列:74VCX 每芯片的通道數(shù)量:16 輸入電平:CMOS 輸出電平:CMOS 輸出類型:3-State 高電平輸出電流:- 24 mA 低電平輸出電流:24 mA 傳播延遲時間:6.2 ns 電源電壓-最大:2.7 V, 3.6 V 電源電壓-最小:1.65 V, 2.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-48 封裝:Reel |
| SC18IS600IPW/S8HP | 功能描述:SC18IS600I 制造商:nxp usa inc. 系列:- 包裝:剪切帶（CT） 零件狀態(tài):在售 協(xié)議:I2C 功能:控制器 接口:SPI 標準:- 電壓 - 電源:2.4 V ~ 3.6 V 電流 - 電源:11mA 工作溫度:-40°C ~ 85°C 封裝/外殼:16-TSSOP（0.173"，4.40mm 寬） 供應(yīng)商器件封裝:16-TSSOP 標準包裝:1 |
| SC18IS600IPW112 | 制造商:Rochester Electronics LLC 功能描述: 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述: |
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