參數(shù)資料
型號(hào)： SB83C196NP
廠商： INTEL CORP
元件分類： 微控制器/微處理器
英文描述： 16-BIT, MROM, 25 MHz, MICROCONTROLLER, PQFP100
封裝： SQFP-100
文件頁(yè)數(shù)： 23/33頁(yè)
文件大?。?/td> 1159K
代理商： SB83C196NP
3
8XC251SA/SB/SP/SQ HIGH-PERFORMANCE CHMOS MICROCONTROLLER
PROCESS INFORMATION
This device is manufactured on P648, a CHMOS IV process. Additional process and reliability information is
available in Intel’s Components Quality and Reliability Handbook (order number 210997). All thermal
impedance data is approximate for static air conditions at 1 watt of power dissipation. Values will change
depending on operating conditions and the application. The Intel Packaging Handbook (order number
240800) describes Intel’s thermal impedance test methodology.
Table 1. Thermal Characteristics
Package Type
θ
100-pin SQFP
55
°C/W
14
°C/W
100-pin QFP
56
°C/W
16
°C/W
Program-memory
Options
XXXXX
XX
X
8
XX
X
Packaging
Options
Temperature
and
Burn-in
Options
A2815-01
Process
Information
Product
Family
Device
Speed
Figure 2. The 8XC196NP Family Nomenclature
Table 2. Description of Product Nomenclature
Parameter
Options
Description
Temperature and Burn-in Options
no mark
Commercial operating temperature range (0°C to 70°C)
with Intel standard burn-in.
Packaging Options
x
QFP
SQFP
Program–memory Options
0
3
No ROM
ROM
Process Information
C
CHMOS
Product Family
196NP
Device Speed
no mark
25 MHz
NOTE: To address the fact that many of the package prefix variables have changed, all package prefix
variables in the document are now indicated with an "x".
JA
JC
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