參數(shù)資料
型號(hào)： SAA7378GP
廠商： NXP Semiconductors N.V.
英文描述： Single Chip Digital Servo Processor and Compact Disc Decoder
中文描述： 單片機(jī)數(shù)字伺服處理器和光盤(pán)解碼器
文件頁(yè)數(shù)： 45/45頁(yè)
文件大?。?/td> 224K
代理商： SAA7378GP
Philips Semiconductors
Preliminary specification: Version 1.0
May 1995
45
Digital Servo Processor and Compact Disc Decoder (CD7)
SAA7378GP
13.
SOLDERING
13.1
Plastic quad flat-packs
13.1.1
During placement and before soldering, the component must be fixed with a droplet of adhesive. After curing the adhesive,
the component can be soldered. The adhesive can be applied by screen printing, pin transfer or syringe dispensing.
Maximum permissible solder temperature is 260
o
C, and maximum duration of package immersion in solder bath is 10 s, if
allowed to cool to less than 150
o
C within 6 s. Typical dwell time is 4 s at 250
o
C.
A modified wave soldering technique is reccommended using two solder waves (dual-wave), in which a turbulent wave with
high upward pressure is followed by a smooth laminar wave. Using a mildly-activated flux eliminates the need for removal
of corrosive residues in most applications.
BY WAVE
13.1.2
Reflow soldering requires the solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the
substrate by screen printing, stencilling or pressure-syringe dispensing before device placement.
Several techniques exist for reflowing; for example, thermal conduction by heated belt, infrared, and vapour-phase reflow.
Dwell times vary between 50 and 300 s according to method. Typical reflow temperatures range from 215 to 250
o
C.
Prehaeting is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 min at 45
o
C.
BY SOLDER PASTE REFLOW
13.1.3
REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING IRON OR PULSE-HEATED
SOLDER TOOL)
Fix the component by first soldering two, diagonally opposite, end pins. Apply the heating tool to the flat part of the pin only.
Contact time must be limited to 10 s at up to 300
o
C. When using proper tools, all other pins can be soldered in one operation
within 2 to 5 s at between 270 and 320
o
C. (Pulse-heated soldering is not recommended for SO packages.)
For pulse-heated solder tool (resistance) soldering of VSO packages, solder is applied to the substrate by dipping or by an
extra thick tin/lead plating before package placement.
14.
DEFINITIONS
15.
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products
can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such
applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use
or sale.
LIFE SUPPORT APPLICATIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
Limiting values
Limiting values are given in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of
the device at these or at any other conditions above those given in the Characteristics sections of the specification is not
implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later
This data sheet contains final product specifications.
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