參數(shù)資料
型號: PC8240VTPU200ETC
廠商: Atmel Corp.
英文描述: Integrated Processor Family
中文描述: 綜合處理器系列
文件頁數(shù): 11/42頁
文件大小: 421K
代理商: PC8240VTPU200ETC
11
PC8240
2149A–HIREL–05/02
Figure 5 depicts the die junction-to-ambient thermal resistance for four typical cases:
1.
A heat sink is not attached to the TBGA package and there exists high board-
level thermal loading of adjacent components.
2.
A heat sink is not attached to the TBGA package and there exists low board-
level thermal loading of adjacent components.
3.
A heat sink (e.g. ChipCoolers #HTS255-P) is attached to the TBGA package and
there exists high board-level thermal loading of adjacent components.
4.
A heat sink (e.g. ChipCoolers #HTS255-P) is attached to the TBGA package and
there exists low board-level thermal loading of adjacent components.
Figure 5.
Die Junction-to-Ambient Resistance
D
Airflow Velocity (m/s)
No heat sink and high thermal board
level loading of
adjacent components
No heat sink and low thermal board
level loading of
adjacent components
Attached heat sink and high thermal board
level loading
of adjacent components
Attached heat sink and low thermal board
level loading
of adjacent components
2
0
0.5
1
1.5
2
2.5
4
6
8
10
12
14
16
18
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