參數(shù)資料
型號(hào)： ORLI10G1BM680-DB
廠商： LATTICE SEMICONDUCTOR CORP
元件分類： FPGA
英文描述： FPGA, 1296 CLBS, 333000 GATES, PBGA680
封裝： PLASTIC, FBGA-680
文件頁(yè)數(shù)： 73/78頁(yè)
文件大小： 1689K
代理商： ORLI10G1BM680-DB
Lattice Semiconductor
ORCA ORLI10G Data Sheet
75
FPSC Maximum Junction Temperature
Once the power dissipated by the FPSC has been determined (see the Estimating Power Dissipation section), the
maximum junction temperature of the FPSC can be found. This is needed to determine if speed derating of the
device from the 85 C junction temperature used in all of the delay tables is needed. Using the maximum ambient
temperature, TAmax, and the power dissipated by the device, Q (expressed in C), the maximum junction tempera-
ture is approximated by:
TJmax = TAmax + (Q * ΘJA)
Table 20 lists the thermal characteristics for all packages used with the ORCA ORLI10G FPSC.
Package Thermal Characteristics
Table 20. ORCA ORLI10G Plastic Package Thermal Guidelines
The ORLI10G in a 680 PBGAM1T package has ΘJC of 3.5 deg C/W.
Heat Sink Vendors for BGA Packages
The estimated worst-case power requirements for the ORLI10G with a programmable XGMII to XSBI interface for
10 Gbits/s Ethernet applications is 4 W to 5 W. Consequently, for most applications an external heat sink will be
required. Below, in alphabetical order, is a list of heat sink vendors who advertise heat sinks aimed at the BGA mar-
ket.
Table 21. Heat Sink Vendors
Package Coplanarity
The coplanarity limits of the packages are as follows:
PBGAM: 8.0 mils
Package
Θ
ΘJA (C/W)
Max Power
0 fpm
200 fpm
500 fpm
T = 70 C Max
TJ = 125 C Max
0 fpm (W)
680-Pin PBGAM
13.4
11.5
10.5
4.10
Note: The 680-Pin PBGAM package includes a 2 oz. copper plate.
Vendor
Location
Phone
Aavid Thermalloy
Concord, NH
(603) 224-9988
Chip Coolers (Tyco Electronics)
Harrisburg, PA
(800) 468-2023
IERC (CTS Corp.)
Burbank, CA
(818) 842-7277
R-Theta
Buffalo, NY
(800) 388-5428
Sanyo Denki
Torrance, CA
(310) 783-5400
Wakeeld Thermal Solutions
Pelham, NH
(603) 635-2800
相關(guān)PDF資料
PDF描述
ORLI10G2BM680-DB FPGA, 1296 CLBS, 333000 GATES, PBGA680
ORLI10G3BM680-DB FPGA, 1296 CLBS, 333000 GATES, PBGA680
ORT82G5-1BM680 FPGA, 1296 CLBS, 380000 GATES, PBGA680
ORT82G5-2BM680 FPGA, 1296 CLBS, 380000 GATES, PBGA680
ORT82G5-3BM680 FPGA, 1296 CLBS, 380000 GATES, PBGA680
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ORLI10G-1BM680I 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門(mén)陣列 10368 LUT 316 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
ORLI10G-1BMN680C 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門(mén)陣列 10368 LUT 316 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
ORLI10G-1BMN680I 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門(mén)陣列 10368 LUT 316 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
ORLI10G-2BM680C 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門(mén)陣列 10368 LUT 316 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
ORLI10G-2BM680I 功能描述:FPGA - 現(xiàn)場(chǎng)可編程門(mén)陣列 10368 LUT 316 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內(nèi)嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-256
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