參數(shù)資料
型號： ORLI10G1BM680-DB
廠商： LATTICE SEMICONDUCTOR CORP
元件分類： FPGA
英文描述： FPGA, 1296 CLBS, 333000 GATES, PBGA680
封裝： PLASTIC, FBGA-680
文件頁數(shù)： 27/78頁
文件大?。?/td> 1689K
代理商： ORLI10G1BM680-DB
Lattice Semiconductor
ORCA ORLI10G Data Sheet
33
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are abso-
lute stress ratings only. Functional operation of the device is not implied at these or any other conditions in excess
of those given in the operations sections of this data sheet. Exposure to absolute maximum ratings for extended
periods can adversely affect device reliability.
The ORCA Series 4 FPSCs include circuitry designed to protect the chips from damaging substrate injection cur-
rents and to prevent accumulations of static charge. Nevertheless, conventional precautions should be observed
during storage, handling, and use to avoid exposure to excessive electrical stress.
Table 4. Absolute Maximum Ratings
Recommended Operating Conditions
Table 5. Recommended Operating Conditions
For FPGA Recommended Operating Conditions and Electrical Characteristics, see the Recommended Operating
Conditions and Electrical Characteristics tables in the ORCA Series 4 FPGA data sheet (OR4E04) and the ORCA
Series 4 I/O Buffer Technical Note. FPSC Standby Currents (IDDSB15 and IDDSB33) are tested with the Embedded
Core in the powered down state.
Notes:
The maximum recommended junction temperature (TJ) during operation is 125 C.
Timing parameters in this data sheet are characterized under tighter voltage and temperature conditions than the recommended operating con-
ditions in this table.
The internal PLLs operate from the VDD33 and VDD33_A power supplies. These power supplies should be well isolated from all other power sup-
plies on the board for proper operation.
Parameter
Symbol
Min
Max
Unit
Storage Temperature
TSTG
–65
150
C
Power Supply Voltage with Respect to Ground
VDD33
–0.3
4.2
V
VDDIO
–0.3
4.2
V
VDD33, VDD33_A
–0.3
4.2
V
VDD15
–0.3
2.0
V
Input Signal with Respect to Ground
VIN
–0.3
VDDIO + 0.3
V
Signal Applied to High-impedance Output
—
–0.3
VDDIO + 0.3
V
Maximum Package Body (Soldering) Temperature
—
220
C
Parameter
Symbol
Min
Max
Unit
Power Supply Voltage with Respect to Ground
VDD33
3.0
3.6
V
VDDIO
1.4
3.6
V
VDD33, VDD33_A
3.0
3.6
V
VDD15
1.425
1.575
V
Input Voltages
VIN
–0.3
VDDIO + 0.3
V
Junction Temperature
TJ
–40
125
C
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相關代理商/技術參數(shù)
參數(shù)描述
ORLI10G-1BM680I 功能描述:FPGA - 現(xiàn)場可編程門陣列 10368 LUT 316 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
ORLI10G-1BMN680C 功能描述:FPGA - 現(xiàn)場可編程門陣列 10368 LUT 316 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
ORLI10G-1BMN680I 功能描述:FPGA - 現(xiàn)場可編程門陣列 10368 LUT 316 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
ORLI10G-2BM680C 功能描述:FPGA - 現(xiàn)場可編程門陣列 10368 LUT 316 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
ORLI10G-2BM680I 功能描述:FPGA - 現(xiàn)場可編程門陣列 10368 LUT 316 I/O RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 柵極數(shù)量: 邏輯塊數(shù)量:943 內嵌式塊RAM - EBR:1956 kbit 輸入/輸出端數(shù)量:128 最大工作頻率:800 MHz 工作電源電壓:1.1 V 最大工作溫度:+ 70 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-256
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