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參數(shù)資料
| 型號： | NAND128W4A3AN6E |
| 廠商： | STMICROELECTRONICS |
| 元件分類： | PROM |
| 英文描述： | 8M X 16 FLASH 3V PROM, 10000 ns, PDSO48 |
| 封裝： | 12 X 20 MM, LEAD FREE, PLASTIC, TSOP-48 |
| 文件頁數(shù)： | 51/56頁 |
| 文件大?。?/td> | 882K |
| 代理商： | NAND128W4A3AN6E |
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NAND128-A, NAND256-A, NAND512-A, NAND01G-A
RELATED DOCUMENTATION
STMicroelectronics has published a set of application notes to support the NAND Flash memories. They
are available from the ST Website
www.st.com. or from your local ST Distributor.
REVISION HISTORY
Table 29. Document Revision History
Date
Version
Revision Details
06-Jun-2003
1.0
First Issue
07-Aug-2003
2.0
Design Phase
27-Oct-2003
3.0
Engineering Phase
03-Dec-2003
4.0
Document promoted from Target Specification to Preliminary Data status.
VCC changed to VDD and ICC to IDD.
Title of Table 2.. changed to “Product Description” and Page Program Typical Timing
for NANDXXXR3A devices corrected. Table 1., Product List, inserted on page 2.
13-Apr-2004
5.0
WSOP48 and VFBGA55 packages added, VFBGA63 (9 x 11 x 1mm) removed.
Figure 19., Cache Program Operation, modified and note 2 modified. Note removed
Meaning of tBLBH4 modified, partly replaced by tWHBH1 and tWHRL min for 3V devices
modified in Table 21., AC Characteristics for Operations.
References removed from RELATED DOCUMENTATION section and reference
made to ST Website instead.
paragraph clarified and Figure 30., Read Electronic Signature AC Waveform,
modified. Note 2 to Figure 32., Read C Operation, One Page AC Waveform, removed.
Note 3 to Table 7., Address Insertion, x16 Devices removed. Only 00h Pointer
Waveform. Small text changes.
28-May-2004
6.0
TFBGA55 package added (mechanical data to be announced). 512Mb Dual Die
devices added. Figure 19., Cache Program Operation modified.
Package code changed for TFBGA63 8.5 x 15 x 1.2mm, 6x8 ball array, 0.8mm pitch
(1Gbit Dual Die devices) in Table 28., Ordering Information Scheme.
02-Jul-2004
7.0
Cache Program removed from document. TFBGA55 package specifications added
Test
conditions
modified
for
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相關(guān)代理商/技術(shù)參數(shù) |
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| NAND16GAH0HZA5E | 制造商:Micron Technology Inc 功能描述:NAND EMMC - Trays |
| NAND16GAH0HZA5F | 制造商:Micron Technology Inc 功能描述:NAND EMMC - Tape and Reel |
| NAND16GAHAPZO6E | 制造商:Micron Technology Inc 功能描述:AUTOMOTIVE - Trays |
| NAND16GW3B6DPA6E | 功能描述:IC FLASH 16GBIT 114LFBGA RoHS:是 類別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:576 系列:- 格式 - 存儲(chǔ)器:閃存 存儲(chǔ)器類型:閃存 - NAND 存儲(chǔ)容量:512M（64M x 8） 速度:- 接口:并聯(lián) 電源電壓:2.7 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:48-TFSOP（0.724"，18.40mm 寬） 供應(yīng)商設(shè)備封裝:48-TSOP 包裝:托盤 其它名稱:497-5040 |
| NAND16GW3B6DPA6F | 功能描述:IC FLASH 16GBIT 114LFBGA RoHS:是 類別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:576 系列:- 格式 - 存儲(chǔ)器:閃存 存儲(chǔ)器類型:閃存 - NAND 存儲(chǔ)容量:512M（64M x 8） 速度:- 接口:并聯(lián) 電源電壓:2.7 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:48-TFSOP（0.724"，18.40mm 寬） 供應(yīng)商設(shè)備封裝:48-TSOP 包裝:托盤 其它名稱:497-5040 |
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