參數(shù)資料
型號: NAND02GW4B2CZA1E
廠商: NUMONYX
元件分類: PROM
英文描述: 128M X 16 FLASH 3V PROM, 25000 ns, PBGA63
封裝: 9.50 X 12 MM, 1 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, VFBGA-63
文件頁數(shù): 6/60頁
文件大?。?/td> 1335K
代理商: NAND02GW4B2CZA1E
Signals description
NAND01G-B2B, NAND02G-B2C
3
Signals description
See Figure 2: Logic diagram, and Table 3: Signal names, for a brief overview of the signals
connected to this device.
3.1
Inputs/outputs (I/O0-I/O7)
Input/outputs 0 to 7 are used to input the selected address, output the data during a read
operation or input a command or data during a write operation. The inputs are latched on
the rising edge of Write Enable. I/O0-I/O7 are left floating when the device is deselected or
the outputs are disabled.
3.2
Inputs/outputs (I/O8-I/O15)
Input/outputs 8 to 15 are only available in x16 devices. They are used to output the data
during a read operation or input data during a write operation. Command and address
Inputs only require I/O0 to I/O7.
The inputs are latched on the rising edge of Write Enable. I/O8-I/O15 are left floating when
the device is deselected or the outputs are disabled.
3.3
Address Latch Enable (AL)
The Address Latch Enable activates the latching of the address inputs in the command
interface. When AL is High, the inputs are latched on the rising edge of Write Enable.
3.4
Command Latch Enable (CL)
The Command Latch Enable activates the latching of the command inputs in the command
interface. When CL is High, the inputs are latched on the rising edge of Write Enable.
3.5
Chip Enable (E)
The Chip Enable input activates the memory control logic, input buffers, decoders and
sense amplifiers. When Chip Enable is Low, VIL, the device is selected. If Chip Enable goes
High, vIH, while the device is busy, the device remains selected and does not go into standby
mode.
3.6
Read Enable (R)
The Read Enable pin, R, controls the sequential data output during read operations. Data is
valid tRLQV after the falling edge of R. The falling edge of R also increments the internal
column address counter by one.
相關(guān)PDF資料
PDF描述
NAND16GW3B4DN6E 4G X 4 FLASH 3V PROM, 25 ns, PDSO48
NAND512R4A2CZD6E 32M X 16 FLASH 1.8V PROM, 15000 ns, PBGA55
NB2762ASNR2G HF - EMI REDUCER; Package: TSOP-6; No of Pins: 6; Container: Tape and Reel; Qty per Container: 2500
NB2762ASNR2 EMI REDUCER SERIES; Package: TSOP-6; No of Pins: 6; Container: Tape and Reel; Qty per Container: 2500
NC7SB121P5X 1-CHANNEL, SGL POLE SGL THROW SWITCH, PDSO5
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
NAND04GR3B2DDI6 制造商:Micron Technology Inc 功能描述:NAND - Gel-pak, waffle pack, wafer, diced wafer on film
NAND04GR3B2DN6E 功能描述:IC FLASH 4GBIT 48TSOP RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:- 標(biāo)準(zhǔn)包裝:576 系列:- 格式 - 存儲器:閃存 存儲器類型:閃存 - NAND 存儲容量:512M(64M x 8) 速度:- 接口:并聯(lián) 電源電壓:2.7 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:48-TFSOP(0.724",18.40mm 寬) 供應(yīng)商設(shè)備封裝:48-TSOP 包裝:托盤 其它名稱:497-5040
NAND04GR3B2DZL6F 制造商:Micron Technology Inc 功能描述:NAND - Tape and Reel
NAND04GR3B2EN6E 制造商:Micron Technology Inc 功能描述:NAND - Trays
NAND04GR3B2EN6F 制造商:Micron Technology Inc 功能描述:NAND - Tape and Reel