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參數(shù)資料
| 型號(hào)： | MSC8144E |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 數(shù)字信號(hào)處理 |
| 英文描述： | 0-BIT, 150 MHz, OTHER DSP, PBGA783 |
| 封裝： | 29 X 29 MM, LEAD FREE, PLASTIC, FCPBGA-783 |
| 文件頁(yè)數(shù)： | 21/80頁(yè) |
| 文件大?。?/td> | 2284K |
| 代理商： | MSC8144E |
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MSC8144E Quad Core Digital Signal Processor Data Sheet, Rev. 0
Electrical Characteristics
Freescale Semiconductor
28
Table 5 describes thermal characteristics of the MSC8144E for the FC-PBGA packages.
2.5
Power Characteristics
The estimated typical power dissipation for MSC8144E versus the core frequency is shown in Table 6.
The typical power values were measured using an EFR code with the device running at a junction temperature of 25°C. No
peripherals were enabled and the ICache was not enabled. The source code was optimized to use all the ALUs and AGUs and
Table 5. Thermal Characteristics for the MSC8144E
Characteristic
Symbol
FC-PBGA
29
× 29 mm5
Unit
Natural
Convection
200 ft/min
(1 m/s) airflow
Junction-to-ambient1, 2
RθJA
20
15
°C/W
Junction-to-ambient, four-layer board1, 3
RθJA
15
12
°C/W
Junction-to-board (bottom)4
RθJB
7
°C/W
Junction-to-case5
RθJC
0.8
°C/W
Notes:
1.
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2.
Per JEDEC JESD51-2 with the single layer board (JESD51-3) horizontal.
3.
Per JEDEC JESD51-6 with the board (JESD51-7) horizontal.
4.
Thermal resistance between the die and the printed circuit board per JEDEC JESD 51-8. Board temperature is measured on
the top surface of the board near the package.
5.
Thermal resistance between the active surface of the die and the case top surface determined by the cold plate method (MIL
SPEC-883 Method 1012.1) with the calculated case temperature.
Table 6. Power Dissipation
Extended Core Frequency
Core Frequency
Typical
Unit
266
400
TBD
W
533
TBD
667
TBD
800
TBD
333
500
TBD
W
667
TBD
833
TBD
1000
TBD
400
TBD
W
600
TBD
800
TBD
1000
TBD
500
TBD
W
750
TBD
1000
TBD
Note:
Measured for 1.0 V core at 25°C junction temperature.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MSC8144EC | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Quad Core Digital Signal Processor |
| MSC8144ESVT1000B | 制造商:Freescale Semiconductor 功能描述:DSP 32-BIT 1GHZ 1000MIPS 783-PIN FCBGA BOX - Trays 制造商:Freescale Semiconductor 功能描述:ENCRYPTION PACSUN R2.1 783FCPBGA |
| MSC8144ESVT800A | 制造商:Freescale Semiconductor 功能描述:DSP 32BIT 800MHZ 800MIPS 783FCBGA - Trays |
| MSC8144ESVT800B | 制造商:Freescale Semiconductor 功能描述:DSP 32-BIT 800MHZ 800MIPS 783-PIN FCBGA EACH - Bulk 制造商:Freescale Semiconductor 功能描述:ENCRYPTION PACSUN R2.1 783FCPBGA |
| MSC8144ETVT1000A | 制造商:Freescale Semiconductor 功能描述:DSP 32-BIT 1GHZ 1000MIPS 783-PIN FCBGA - Bulk |
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