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參數(shù)資料
| 型號： | MPC8323ECZQAFDC |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 70/82頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC MPU PWRQUICC II 516-PBGA |
| 產(chǎn)品培訓模塊： | MPC8323E PowerQUICC II Pro Processor |
| 標準包裝： | 40 |
| 系列： | MPC83xx |
| 處理器類型： | 32-位 MPC83xx PowerQUICC II Pro |
| 速度： | 333MHz |
| 電壓： | 1V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 516-BBGA |
| 供應商設備封裝： | 516-FPBGA（27x27） |
| 包裝： | 托盤 |
| 配用： | MPC8323E-RDB-ND - BOARD REFERENCE DESIGN |
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MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4
72
Freescale Semiconductor
Thermal
23.2
Thermal Management Information
For the following sections, PD = (VDD × IDD) + PI/O, where PI/O is the power dissipation of the I/O drivers.
23.2.1
Estimation of Junction Temperature with Junction-to-Ambient
Thermal Resistance
An estimation of the chip junction temperature, TJ, can be obtained from the equation:
TJ = TA + (RθJA × PD)
where:
TJ = junction temperature (°C)
TA = ambient temperature for the package (°C)
RθJA = junction-to-ambient thermal resistance (°C/W)
PD = power dissipation in the package (W)
The junction-to-ambient thermal resistance is an industry standard value that provides a quick and easy
estimation of thermal performance. As a general statement, the value obtained on a single layer board is
appropriate for a tightly packed printed-circuit board. The value obtained on the board with the internal
planes is usually appropriate if the board has low power dissipation and the components are well separated.
Test cases have demonstrated that errors of a factor of two (in the quantity TJ – TA) are possible.
23.2.2
Estimation of Junction Temperature with Junction-to-Board
Thermal Resistance
The thermal performance of a device cannot be adequately predicted from the junction-to-ambient thermal
resistance. The thermal performance of any component is strongly dependent on the power dissipation of
surrounding components. In addition, the ambient temperature varies widely within the application. For
many natural convection and especially closed box applications, the board temperature at the perimeter
Junction-to-package top
Natural convection
ΨJT
2°C/W
6
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2. Per JEDEC JESD51-2 with the single layer board horizontal. Board meets JESD51-9 specification.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
the top surface of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
1012.1).
6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
Table 64. Package Thermal Characteristics for PBGA (continued)
Characteristic
Board type
Symbol
Value
Unit
Notes
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MPC8323ECZQAFDCA | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Integrated Communications Processor Family Hardware Specifications |
| MPC8323EEC | 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Integrated Communications Processor Family Hardware Specifications |
| MPC8323E-MDS-PB | 功能描述:開發(fā)板和工具包 - 其他處理器 MPC8323E PROCESSOR BOARD RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓: |
| MPC8323E-RDB | 功能描述:開發(fā)板和工具包 - 其他處理器 REFERENCE DESIGN PQII PR RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓: |
| MPC8323E-RDB | 制造商:Freescale Semiconductor 功能描述:MPC8323E Integrated Multiservice Gateway |
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