參數(shù)資料
型號： MPC8323ECZQAFDC
廠商： Freescale Semiconductor
文件頁數(shù)： 69/82頁
文件大?。?/td> 0K
描述： IC MPU PWRQUICC II 516-PBGA
產(chǎn)品培訓模塊： MPC8323E PowerQUICC II Pro Processor
標準包裝： 40
系列： MPC83xx
處理器類型： 32-位 MPC83xx PowerQUICC II Pro
速度： 333MHz
電壓： 1V
安裝類型： 表面貼裝
封裝/外殼： 516-BBGA
供應商設備封裝： 516-FPBGA（27x27）
包裝： 托盤
配用： MPC8323E-RDB-ND - BOARD REFERENCE DESIGN
MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4
Freescale Semiconductor
71
Thermal
22.7
Suggested PLL Configurations
To simplify the PLL configurations, the MPC8323E might be separated into two clock domains. The first
domain contain the CSB PLL and the core PLL. The core PLL is connected serially to the CSB PLL, and
has the csb_clk as its input clock. The second clock domain has the QUICC Engine PLL. The clock
domains are independent, and each of their PLLs are configured separately. Both of the domains has one
common input clock. Table 63 shows suggested PLL configurations for 33, 25, and 66 MHz input clocks.
23 Thermal
This section describes the thermal specifications of the MPC8323E.
23.1
Thermal Characteristics
Table 64 provides the package thermal characteristics for the 516 27
× 27 mm PBGA of the MPC8323E.
Table 63. Suggested PLL Configurations
Conf No.
SPMF
Core
PLL
CEMF
CEDF
Input Clock
Frequency
(MHz)
CSB
Frequency
(MHz)
Core
Frequency
(MHz)
QUICC
Engine
Frequency
(MHz)
1
0100
0000100
0110
0
33.33
133.33
266.66
200
2
0100
0000101
1000
0
25
100
250
200
3
0010
0000100
0011
0
66.67
133.33
266.66
200
4
0100
0000101
0110
0
33.33
133.33
333.33
200
5
0101
0000101
1000
0
25
125
312.5
200
6
0010
0000101
0011
0
66.67
133.33
333.33
200
Table 64. Package Thermal Characteristics for PBGA
Characteristic
Board type
Symbol
Value
Unit
Notes
Junction-to-ambient natural convection
Single-layer board (1s)
RθJA
28
°C/W
1, 2
Junction-to-ambient natural convection
Four-layer board (2s2p)
RθJA
21
°C/W
1, 2, 3
Junction-to-ambient (@200 ft/min)
Single-layer board (1s)
RθJMA
23
°C/W
1, 3
Junction-to-ambient (@200 ft/min)
Four-layer board (2s2p)
RθJMA
18
°C/W
1, 3
Junction-to-board
—
RθJB
13
°C/W
4
Junction-to-case
—
RθJC
9°C/W
5
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相關代理商/技術參數(shù)
參數(shù)描述
MPC8323ECZQAFDCA 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Integrated Communications Processor Family Hardware Specifications
MPC8323EEC 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Integrated Communications Processor Family Hardware Specifications
MPC8323E-MDS-PB 功能描述:開發(fā)板和工具包 - 其他處理器 MPC8323E PROCESSOR BOARD RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓:
MPC8323E-RDB 功能描述:開發(fā)板和工具包 - 其他處理器 REFERENCE DESIGN PQII PR RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓:
MPC8323E-RDB 制造商:Freescale Semiconductor 功能描述:MPC8323E Integrated Multiservice Gateway
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