- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄1955 > MPC603RVG300LC (Freescale Semiconductor)MPU RISC PID7V-603E 255FCCBGA PDF資料下載
參數(shù)資料
| 型號(hào)： | MPC603RVG300LC |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 16/31頁 |
| 文件大小： | 0K |
| 描述： | MPU RISC PID7V-603E 255FCCBGA |
| 標(biāo)準(zhǔn)包裝： | 60 |
| 系列： | MPC6xx |
| 處理器類型： | 32-位 MPC603e PowerPC |
| 速度： | 300MHz |
| 電壓： | 2.5V |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 255-BCBGA 裸露焊盤，255-FCCBGA |
| 供應(yīng)商設(shè)備封裝： | 255-FCCBGA（21x21） |
| 包裝： | 托盤 |
第1頁第2頁第3頁第4頁第5頁第6頁第7頁第8頁第9頁第10頁第11頁第12頁第13頁第14頁第15頁當(dāng)前第16頁第17頁第18頁第19頁第20頁第21頁第22頁第23頁第24頁第25頁第26頁第27頁第28頁第29頁第30頁第31頁
PID7t-603e Hardware Specifications, Rev. 5
Freescale Semiconductor
23
System Design Information
8.5
Pull-up Resistor Requirements
The 603e requires high-resistive (weak: 10 K
) pull-up resistors on several control signals of the bus
interface to maintain the control signals in the negated state after they have been actively negated and
released by the 603e or other bus master. These signals are: TS, ABB, DBB, and ARTRY.
In addition, the 603e has three open-drain style outputs that require pull-up resistors (weak or stronger:
4.7 K
–10 K) if they are used by the system. These signals are: APE, DPE, and CKSTP_OUT.
During inactive periods on the bus, the address and transfer attributes on the bus are not driven by any
master and may float in the high-impedance state for relatively long periods of time. Since the 603e must
continually monitor these signals for snooping, this float condition may cause excessive power draw by
the input receivers on the 603e. It is recommended that these signals be pulled up through weak (10 K
)
pull-up resistors or restored in some manner by the system. The snooped address and transfer attribute
inputs are—A[0–31], AP[0–3], TT[0–4], TBST, and GBL.
The data bus input receivers are normally turned off when no read operation is in progress and do not
require pull-up resistors on the data bus.
8.6
Thermal Management Information
This section provides thermal management information for the CBGA and PBGA packages for air-cooled
applications. Proper thermal control design is primarily dependent upon the system-level design—the heat
sink, airflow and thermal interface material.
This figure shows the upper and lower limits of the die junction-to-ambient thermal resistance for both
package styles. The lower limit is shown for the case of a densely populated PCB with high thermal
loading of adjacent and neighboring components.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| MPC8266AVVPJDC | IC MPU POWERQUICC II 480-TBGA |
| MPC8272ZQTMFA | IC MPU POWERQUICC II 516-PBGA |
| MPC8306CVMADDCA | IC PROCESSOR E300 369MAPBGA |
| MPC8308VMAFF | IC PROCESSOR E300 473MAPBGA |
| MPC8309CVMAFDCA | IC PROCESSOR E300 489MAPBGA |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MPC603RZT200LC | 功能描述:微處理器 - MPU 603E 255PBGA RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324 |
| MPC604E | 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:PowerPC 604e-TM RISC Microprocessor Technical Summary |
| MPC6071 | 制造商:International Rectifier 功能描述: |
| MPC616 | 制造商:Hammond Manufacturing 功能描述:6" X 16" MAGNET PANEL COVER |
| MPC-628-011B | 制造商:FCI 功能描述: |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。