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參數(shù)資料
| 型號： | MD2533-D16G-X-P/Y |
| 廠商： | SANDISK CORP |
| 元件分類： | 存儲控制器/管理單元 |
| 英文描述： | FLASH MEMORY DRIVE CONTROLLER, PBGA115 |
| 封裝： | 12 X 18 MM, 1.40 MM HEIGHT, FBGA-115 |
| 文件頁數(shù)： | 12/87頁 |
| 文件大?。?/td> | 1675K |
| 代理商： | MD2533-D16G-X-P/Y |
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Rev. 1.2
mDOC H3 EFD Featuring Embedded TrueFFS Data Sheet
2
92-DS-1205-10
enabling read/write operations that are
identical to a standard, sector-based hard drive.
In addition, Embedded TrueFFS employs
patented methods, such as virtual mapping,
dynamic and static wear-leveling, and
automatic block management to ensure high
data reliability and maximize flash life
expectancy.
Furthermore, it provides performance
enhancements such as multi-plane operations,
DMA support, Burst operation and Dual Data
RAM buffering.
mDOC H3 extended features are enabled by a
small driver that runs on the host side, called
DOC Driver. DOC Driver provides the host
OS with a standard Block Device interface.
The combination of Embedded TrueFFS and
DOC Driver enables a practically Plug & Play
integration in the system.
PLUG-AND-PLAY INTEGRATION
mDOC H3 optimized architecture with
Embedded TrueFFS eliminates the need for
complicated software integration and testing
processes and enables a practically plug-and-
play integration in the system.
The replacement of one mDOC H3 device with
another, of a newer generation, requires
virtually no changes to the host. This makes
mDOC H3 the perfect solution for platforms
and reference designs, as it allows for the
utilization of more advanced NAND Flash
technology with minimal integration or
qualification efforts.
Embedded TrueFFS running from mDOC H3
means there is no need to modify and re-
qualify the flash management software on the
host system, or update mass production tools.
MULTIPLE FLASH SUPPORT
mDOC H3 with Embedded TrueFFS enables
access to advanced binary SLC NAND and
MLC NAND flash technology, making mDOC
H3 the only multi-sourced and multi-
technology EFD.
Embedded TrueFFS overcomes SLC and MLC
NAND-related error patterns by using a robust
error detection and correction (EDC/ECC)
mechanism.
mDOC H3 optimized architecture with
Embedded TrueFFS offers high reliability and
high system performance for whatever flash
technology or density utilized.
M
DOC H3 PROVIDES:
Flash disk for both code and data storage
Code and data storage protection
Low voltage:
1.8V Core and I/O
3.3V Core and 3.3V/1.8V I/O (auto-detect)
Typical Current Consumption
Turbo mode: 30mA
Power Save mode: 20mA
Standby mode: 5mA
Deep Power-Down mode: 60uA-
110uA
1Gb (128MB) – 64Gb (8GB) data storage
capacity, with device cascading options for
up to 128Gb (16GB).
Enhanced Programmable Boot Block
(32KB) enabling eXecute In Place (XIP)
functionality using 16-bit access.
Small form factors:
mDOC H3 1Gb/2Gb - 115-ball
Fine-Pitch Ball Grid Array
(FBGA) 9x12mm.
mDOC H3 4Gb/8Gb - 115-ball
Fine-Pitch Ball Grid Array
(FBGA) 10x14mm.
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| MD2533-D8G-X-P | 功能描述:IC MDOC H3 8GB FBGA RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:- 標準包裝:150 系列:- 格式 - 存儲器:EEPROMs - 串行 存儲器類型:EEPROM 存儲容量:4K (2 x 256 x 8) 速度:400kHz 接口:I²C，2 線串口 電源電壓:2.5 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-VFDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:8-DFN（2x3） 包裝:管件 產(chǎn)品目錄頁面:1445 (CN2011-ZH PDF) |
| MD2533-D8G-X-P/Y | 功能描述:IC MDOC H3 8GB FBGA RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:- 標準包裝:150 系列:- 格式 - 存儲器:EEPROMs - 串行 存儲器類型:EEPROM 存儲容量:4K (2 x 256 x 8) 速度:400kHz 接口:I²C，2 線串口 電源電壓:2.5 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-VFDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:8-DFN（2x3） 包裝:管件 產(chǎn)品目錄頁面:1445 (CN2011-ZH PDF) |
| MD2534-D1G-X-P | 功能描述:IC MDOC H3 1GB FBGA RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:- 標準包裝:150 系列:- 格式 - 存儲器:EEPROMs - 串行 存儲器類型:EEPROM 存儲容量:4K (2 x 256 x 8) 速度:400kHz 接口:I²C，2 線串口 電源電壓:2.5 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-VFDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:8-DFN（2x3） 包裝:管件 產(chǎn)品目錄頁面:1445 (CN2011-ZH PDF) |
| MD2534-D1G-X-P/Y | 功能描述:IC MDOC H3 1GB 115-BGA RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:- 標準包裝:150 系列:- 格式 - 存儲器:EEPROMs - 串行 存儲器類型:EEPROM 存儲容量:4K (2 x 256 x 8) 速度:400kHz 接口:I²C，2 線串口 電源電壓:2.5 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-VFDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:8-DFN（2x3） 包裝:管件 產(chǎn)品目錄頁面:1445 (CN2011-ZH PDF) |
| MD2534-D2G-X-P | 功能描述:IC MDOC H3 2GB FBGA RoHS:是 類別:集成電路 (IC) >> 存儲器 系列:- 標準包裝:150 系列:- 格式 - 存儲器:EEPROMs - 串行 存儲器類型:EEPROM 存儲容量:4K (2 x 256 x 8) 速度:400kHz 接口:I²C，2 線串口 電源電壓:2.5 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:8-VFDFN 裸露焊盤 供應(yīng)商設(shè)備封裝:8-DFN（2x3） 包裝:管件 產(chǎn)品目錄頁面:1445 (CN2011-ZH PDF) |
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