參數(shù)資料
型號： MCRF360
廠商： Microchip Technology Inc.
英文描述： CONNECTOR
中文描述： 連接器
文件頁數(shù)： 5/23頁
文件大小： 568K
代理商： MCRF360
2002 Microchip Technology Inc.
DS21287F-page 5
MCRF355/360
TABLE 1-4:
PAD COORDINATES (MICRONS)
FIGURE 1-1:
DIE LAYOUT
Pad Name
Lower
Left X
Lower
Left Y
Upper
Right X
Upper
Right Y
Passivation Openings
Pad
Center X
Pad
Center Y
Pad Width
Pad Height
Ant. A
-610.0
489.2
-521.0
578.2
89
89
-565.5
533.7
Ant. B
-605.0
-579.8
-516.0
-490.8
89
89
-560.5
-535.3
V
SS
-605.0
-58.2
-516.0
30.8
89
89
-560.5
-13.7
V
DD
463.4
-181.4
552.4
-92.4
89
89
507.9
-136.9
CLK
463.4
496.8
552.4
585.8
89
89
507.9
541.3
V
PRG
463.4
157.6
552.4
246.6
89
89
507.9
202.1
Note 1:
All coordinates are referenced from the center of the die. The minimum distance between pads (edge to
edge) is 10 mil.
2:
Die Size = 1.417 mm x 1.513 mm = 1417
μ
m x 1513
μ
m = 55.79 mil x 59.57 mil
1157.4
1162.4
1
7
458.4
432.6
250.2
250
1417
CLK
V
PRG
V
DD
1
X
Y (Notch edge of wafer)
Ant A
V
SS
Ant B
x
x
x
x
x
x
Die size before saw:
Die size after saw:
Bond pad size:
1417
μ
m x 1513
μ
m
1353.8
μ
m x 1450.34
μ
m
89
μ
m x 89
μ
m
55.79 mil x 59.57 mil
53.3 x 57.1 mil
3.5 mil x 3.5 mil
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