參數(shù)資料
型號： MCRF360
廠商： Microchip Technology Inc.
英文描述： CONNECTOR
中文描述： 連接器
文件頁數(shù)： 15/23頁
文件大小： 568K
代理商： MCRF360
2002 Microchip Technology Inc.
DS21287F-page 15
MCRF355/360
8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
B1
B
A1
A
L
A2
p
α
E
eB
β
c
E1
n
D
1
2
UNITS
INCHES*
NOM
MILLIMETERS
NOM
DIMENSION LIMITS
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
MIN
MAX
MIN
MAX
n
p
8
8
2.54
3.94
3.30
.100
.155
.130
A
A2
A1
E
E1
D
L
c
.140
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
.170
.145
3.56
2.92
0.38
7.62
6.10
9.14
3.18
0.20
1.14
0.36
7.87
4.32
3.68
.313
.250
.373
.130
.012
.058
.018
.370
.325
.260
.385
.135
.015
.070
.022
.430
7.94
6.35
9.46
3.30
0.29
1.46
0.46
9.40
10
10
8.26
6.60
9.78
3.43
0.38
1.78
0.56
10.92
15
15
B1
B
eB
α
β
§
5
5
10
10
15
15
5
5
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
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