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參數(shù)資料
| 型號(hào)： | MC68EC030 |
| 廠商： | Motorola, Inc. |
| 英文描述： | Second-Generation 32-Bit Enhanced Embedded Controller |
| 中文描述： | 第二代32位增強(qiáng)型嵌入式控制器 |
| 文件頁數(shù)： | 21/36頁 |
| 文件大小： | 392K |
| 代理商： | MC68EC030 |
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MOTOROLA
MC68EC030 TECHNICAL DATA
Go to: www.freescale.com
21
The total thermal resistance of a package (
θ
JA) can be separated into two components,
θ
JC and
θ
CA,
representing the barrier to heat flow from the semiconductor junction to the package (case) surface (
θ
JC)
and from the case to the outside ambient air (
θ
CA). These terms are related by the equation:
θ
JA=
θ
JC +
θ
CA
(4)
θ
JC is device related and cannot be influenced by the user. However,
θ
CA is user dependent and can
be minimized by such thermal management techniques as heat sinks, ambient air cooling, and thermal
convection. Thus, good thermal management on the part of the user can significantly reduce
θ
CA so that
θ
JA approximately equals;
θ
JC. Substitution of
θ
JC for
θ
JA in equation (1) results in a lower
semiconductor junction temperature.
Values for thermal resistance presented in this document, unless estimated, were derived using the
procedure described in Motorola Reliability Report 7843, “Thermal Resistance Measurement Method for
MC68XX Microcomponent Devices,” and are provided for design purposes only. Thermal measurements
are complex and dependent on procedure and setup. User derived values for thermal resistance may
differ.
AC ELECTRICAL SPECIFICATION DEFINITIONS
The AC specifications presented consist of output delays, input setup and hold times, and signal skew
times. All signals are specified relative to an appropriate edge of the clock and possibly to one or more
other signals.
The measurement of the AC specifications is defined by the waveforms shown in Figure 9. To test the
parameters guaranteed by Motorola, inputs must be driven to the voltage levels specified in Figure 9.
Outputs are specified with minimum and/or maximum limits, as appropriate, and are measured as shown in
Figure 9. Inputs are specified with minimum setup and hold times, and are measured as shown. Finally,
the measurement for signal-to-signal specifications is also shown.
Note that the testing levels used to verify conformance to the AC specifications does not affect the
guaranteed DC operation of the device as specified in the DC electrical specifications.
F
Freescale Semiconductor, Inc.
n
.
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