參數(shù)資料
型號: L6711TR
廠商: 意法半導體
英文描述: 3 PHASE CONTROLLER WITH DYNAMIC VID AND SELECTABLE DACs
中文描述: 3相控制器,動態(tài)VID和可選數(shù)模轉(zhuǎn)換器
文件頁數(shù): 6/38頁
文件大?。?/td> 591K
代理商: L6711TR
L6711
6/38
38
VCCDR3
Channel 3 LS driver supply: it can be varied from 5V to 12V buses.
It must be connected together with other VCCDRx pins.
Filter locally with at least 1
μ
F ceramic cap vs. PGND3.
Channel 2 LS driver return path.
Connect to Power Ground Plane.
Channel 2 LS driver output.
A little series resistor helps in reducing device-dissipated power.
Channel 2 LS driver supply: it can be varied from 5V to 12V buses.
It must be connected together with other VCCDRx pins.
Filter locally with at least 1
μ
F ceramic cap vs. PGND2.
Channel 2 HS driver return path. It must be connected to the HS2 mosfet source and provides
the return path for the HS driver of channel 2.
Channel 2 HS driver output.
A little series resistor helps in reducing device-dissipated power.
Channel 2 HS driver supply. This pin supplies the relative high side driver.
Connect through a capacitor (100nF Typ.) to the PHASE2 pin and through a diode to VCC (cath-
ode vs. boot).
Channel 1 HS driver supply. This pin supplies the relative high side driver.
Connect through a capacitor (100nF Typ.) to the PHASE1 pin and through a diode to VCC (cath-
ode vs. boot).
Channel 1 HS driver output.
A little series resistor helps in reducing device-dissipated power.
Channel 1 HS driver return path. It must be connected to the HS1 mosfet source and provides
the return path for the HS driver of channel 1.
Not internally connected.
Thermal pad connects the silicon substrate and makes a good thermal contact with the PCB to
dissipate the power necessary to drive the external mosfets. Connect to the GND plane with sev-
eral vias to improve thermal conductivity.
39
PGND2
40
LGATE2
41
VCCDR2
42
PHASE2
43
UGATE2
44
BOOT2
45
BOOT1
46
UGATE1
47
PHASE1
48
PAD
N.C.
THERM
AL PAD
Electrical Characteristcs
(V
CC
=12V±15%, T
J
= 0°C to 70°C unless otherwise specified)
Symbol
Parameter
Test Condition
Min.
Typ.
Max.
Unit
V
CC
SUPPLY CURRENT
I
CC
VCC supply current
HGATEx and LGATEx open
VCCDRx=VBOOTx=12V
18
23
mA
I
CCDRx
VCCDRx supply current
LGATEx open; VCCDRx=12V
1.5
2
mA
I
BOOTx
BOOTx supply current
HGATEx open;PHASEx to
PGNDx
VCC=BOOTx=12V
1
1.5
mA
POWER-ON
Turn-On VCC threshold
VCC Rising; VCCDRx=5V
8.2
9.2
10.2
V
Turn-Off VCC threshold
VCC Falling; VCCDRx=5V
6.5
7.5
8.5
V
Turn-On VCCDRx
Threshold
VCCDRx Rising
VCC=12V
4.2
4.4
4.6
V
Table 4. Pin Function
(continued)
Name
Description
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