參數(shù)資料
型號(hào): KFM2G16Q2M-DED6
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: MuxOneNAND FLASH MEMORY
中文描述: MuxOneNAND閃存
文件頁數(shù): 7/124頁
文件大小: 1550K
代理商: KFM2G16Q2M-DED6
MuxOneNAND1G(KFM1G16Q2M-DEB5)
MuxOneNAND2G(KFN2G16Q2M-DEB5)
FLASH MEMORY
7
Device Architecture
Design Technology:
Supply Voltage:
Host Interface:
5KB Internal BufferRAM:
SLC NAND Array:
Device Performance
Host Interface Type:
- Up to 54MHz clock frequency
- Linear Burst 4-, 8-, 16, 32-words with wrap around
- Continuous 1K word Sequential Burst
Asynchronous Random Read
- 76ns access time
Asynchronous Random Write
Latency 3(up to 40MHz), 4, 5, 6, and 7
Up to 4 sectors using Sector Count Register
Cold/Warm/Hot/NAND Flash Resets
up to 64 Blocks
Typical Power,
Programmable Burst Read Latency
Multiple Sector Read:
Multiple Reset Modes:
Multi Block Erase
Low Power Dissipation:
- Standby current : 10uA
- Synchronous Burst Read current(54MHz) : 12mA
- Load current : 30mA
- Program current : 25mA
- Erase current : 20mA
- Multi Block Erase current : 20mA
Reliable CMOS Floating-Gate Technology - Endurance : 100K Program/Erase Cycles
- Data Retention : 10 Years
System Hardware
Voltage detector generating internal reset signal from Vcc
Hardware reset input (/RP)
Data Protection Modes
User-controlled One Time Programmable(OTP) area
Internal 2bit EDC / 1bit ECC
Internal Bootloader supports Booting Solution in system
Handshaking Feature
Detailed chip information
Packaging
1G products
2G DDP products
90nm
1.8V (1.7V ~ 1.95V)
16 bit
1KB BootRAM, 4KB DataRAM
(2K+64)B Page Size, (128K+4K)B Block Size
Synchronous Burst Read
- Write Protection for BootRAM
- Write Protection for NAND Flash Array
- Write Protection during power-up
- Write Protection during power-down
- INT pin indicates Ready / Busy
- Polling the interrupt register status bit
- by ID register
63ball, 10mm x 13mm x max 1.0mmt , 0.8mm ball pitch FBGA
63ball, 11mm x 13mm x max 1.2mmt , 0.8mm ball pitch FBGA (TBD)
1.5 Product Features
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PDF描述
KFN2G16Q2M-DED5 MuxOneNAND FLASH MEMORY
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