參數(shù)資料
型號: KBE00G003M-D411
廠商: SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述: NAND 512Mb*2 + Mobile SDRAM 256Mb*2
中文描述: NAND閃存的512Mb * 2移動SDRAM 256Mb的* 2
文件頁數(shù): 43/89頁
文件大?。?/td> 1238K
代理商: KBE00G003M-D411
KBE00G003M-D411
MCP MEMORY
July 2005
43
Revision 0.1
READY/BUSY
The device has a R/B output that provides a hardware method of indicating the completion of a page program, erase and random
read completion. The R/B pin is normally high but transitions to low after program or erase command is written to the command regis-
ter or random read is started after address loading. It returns to high when the internal controller has finished the operation. The pin is
an open-drain driver thereby allowing two or more R/B outputs to be Or-tied. Because pull-up resistor value is related to tr(R/B) and
current drain during busy(ibusy) , an appropriate value can be obtained with the following reference chart(Fig 25). Its value can be
determined by the following guidance.
V
CC
R/B
open drain output
Device
GND
Rp
Figure 22. Rp vs tr ,tf & Rp vs ibusy
ibusy
Busy
Ready Vcc
VOH
tf
tr
VOL
C
L
0.4V, V
OH
: Vcc
Q
-0.4V
t
I
Rp(ohm)
Ibusy
tr
@ Vcc = 2.7V, Ta = 25
°
C , C
L
= 30pF
1K
2K
3K
4K
100n
200n
300n
3m
2m
1m
30
tf
60
90
120
2.3
2.3
2.3
2.3
2.3
1.1
0.75
0.55
where I
L
is the sum of the input currents of all devices tied to the R/B pin.
Rp(max) is determined by maximum permissible limit of tr
Rp value guidance
Rp(min, 2.7V part) =
V
CC
(Max.) - V
OL
(Max.)
I
OL
+
Σ
I
L
=
2.5V
3mA
+
Σ
I
L
相關(guān)PDF資料
PDF描述
KBE00S009M 1Gb NAND x 2 + 256Mb Mobile SDRAM x 2
KBE00S009M-D411 1Gb NAND x 2 + 256Mb Mobile SDRAM x 2
KBJ2501 25A SINGLE PHASE SILICON BRIDGE RECTIFIER
KBJ2502 25A SINGLE PHASE SILICON BRIDGE RECTIFIER
KBJ2503 25A SINGLE PHASE SILICON BRIDGE RECTIFIER
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