參數(shù)資料
型號： KAB04D100M-TNGP
廠商： SAMSUNG SEMICONDUCTOR CO. LTD.
英文描述： Multi-Chip Package MEMORY
中文描述： 多芯片封裝存儲器
文件頁數(shù)： 24/72頁
文件大小： 1378K
代理商： KAB04D100M-TNGP
KAB0xD100M - TxGP
Revision 1.11
August 2003
- 24 -
MCP MEMORY
SEC Only
Table 13. NOR Flash Memory Block Group Address (Bottom Boot Block)
Block Group
Block Address
Block
A21
A20
A19
A18
A17
A16
A15
A14
A13
A12
BGA0
0
0
0
0
0
0
0
0
0
0
BA0
BGA1
0
0
0
0
0
0
0
0
0
1
BA1
BGA2
0
0
0
0
0
0
0
0
1
0
BA2
BGA3
0
0
0
0
0
0
0
0
1
1
BA3
BGA4
0
0
0
0
0
0
0
1
0
0
BA4
BGA5
0
0
0
0
0
0
0
1
0
1
BA5
BGA6
0
0
0
0
0
0
0
1
1
0
BA6
BGA7
0
0
0
0
0
0
0
1
1
1
BA7
BGA8
0
0
0
0
0
0
1
X
X
X
BA8 to BA10
1
0
1
1
BGA9
0
0
0
0
1
X
X
X
X
X
BA11 to BA14
BGA10
0
0
0
1
0
X
X
X
X
X
BA15 to BA18
BGA11
0
0
0
1
1
X
X
X
X
X
BA19 to BA22
BGA12
0
0
1
0
0
X
X
X
X
X
BA23 to BA26
BGA13
0
0
1
0
1
X
X
X
X
X
BA27 to BA30
BGA14
0
0
1
1
0
X
X
X
X
X
BA31 to BA34
BGA15
0
0
1
1
1
X
X
X
X
X
BA35 to BA38
BGA16
0
1
0
0
0
X
X
X
X
X
BA39 to BA42
BGA17
0
1
0
0
1
X
X
X
X
X
BA43 to BA46
BGA18
0
1
0
1
0
X
X
X
X
X
BA47 to BA50
BGA19
0
1
0
1
1
X
X
X
X
X
BA51 to BA54
BGA20
0
1
1
0
0
X
X
X
X
X
BA55 to BA58
BGA21
0
1
1
0
1
X
X
X
X
X
BA59 to BA62
BGA22
0
1
1
1
0
X
X
X
X
X
BA63 to BA66
BGA23
0
1
1
1
1
X
X
X
X
X
BA67 to BA70
BGA24
1
0
0
0
0
X
X
X
X
X
BA71 to BA74
BGA25
1
0
0
0
1
X
X
X
X
X
BA75 to BA78
BGA26
1
0
0
1
0
X
X
X
X
X
BA79 to BA82
BGA27
1
0
0
1
1
X
X
X
X
X
BA83 to BA86
BGA28
1
0
1
0
0
X
X
X
X
X
BA87to BA90
BGA29
1
0
1
0
1
X
X
X
X
X
BA91 to BA94
BGA30
1
0
1
1
0
X
X
X
X
X
BA95 to BA98
BGA31
1
0
1
1
1
X
X
X
X
X
BA99 to BA102
BGA32
1
1
0
0
0
X
X
X
X
X
BA103 to BA106
BGA33
1
1
0
0
1
X
X
X
X
X
BA107 to BA110
BGA34
1
1
0
1
0
X
X
X
X
X
BA111 to BA114
BGA35
1
1
0
1
1
X
X
X
X
X
BA115 to BA118
BGA36
1
1
1
0
0
X
X
X
X
X
BA119 to BA122
BGA37
1
1
1
0
1
X
X
X
X
X
BA123 to BA126
BGA38
1
1
1
1
0
X
X
X
X
X
BA127 to BA130
BGA39
1
1
1
1
1
0
0
X
X
X
BA131 to BA133
0
1
1
0
BGA40
1
1
1
1
1
1
1
X
X
X
BA134
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KAB-1/2 制造商:COOPER BUSSMANN 功能描述:TRON RECTIFIER FUSE
KAB-10 功能描述:保險(xiǎn)絲 10A RoHS:否 制造商:Littelfuse 產(chǎn)品:Surface Mount Fuses 電流額定值:0.5 A 電壓額定值:600 V 保險(xiǎn)絲類型:Fast Acting 保險(xiǎn)絲大小/組:Nano 尺寸:12.1 mm L x 4.5 mm W 安裝風(fēng)格: 端接類型:SMD/SMT 系列:485
KAB-100 制造商:Cooper Bussmann 功能描述:
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