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參數資料
| 型號： | IDT72T36135ML5BBG |
| 廠商： | IDT, Integrated Device Technology Inc |
| 文件頁數： | 21/48頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC FIFO 1MX18 5NS 240BGA |
| 標準包裝： | 1 |
| 系列： | 72T |
| 功能： | 異步，同步 |
| 存儲容量： | 18M（1M x 18） |
| 訪問時間： | 5ns |
| 電源電壓： | 2.375 V ~ 2.625 V |
| 工作溫度： | 0°C ~ 70°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 240-BGA |
| 供應商設備封裝： | 240-PBGA（19x19） |
| 包裝： | 托盤 |
| 其它名稱： | 72T36135ML5BBG |
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COMMERCIAL AND INDUSTRIAL
TEMPERATURE RANGES
IDT72T36135M 2.5V 18M-BIT TeraSync
36-BIT FIFO
524,288 x 36
28
FEBRUARY 04, 2009
SCAN REGISTER DESCRIPTIONS
THE INSTRUCTION REGISTER
TheInstructionregisterallowsaninstructiontobeshiftedinseriallyintothe
processor at the rising edge of TCLK.
The Instruction is used to select the test to be performed, or the test data
registertobeaccessed,orboth. Theinstructionshiftedintotheregisterislatched
at the completion of the shifting process when the TAP controller is at Update-
IRstate.
The instruction register must contain 8 bit instruction register-based cells
whichcanholdinstructiondata. Thesemandatorycellsarelocatednearestthe
serial outputs they are the least significant bits.
TEST DATA REGISTER
The Test Data register contains three test data registers: the Bypass, the
Boundary Scan register and Device ID register.
These registers are connected in parallel between a common serial input
and a common serial data output.
The following sections provide a brief description of each element. For a
completedescription,refertotheIEEEStandardTestAccessPortSpecification
(IEEE Std. 1149.1-1990).
TEST BYPASS REGISTER
The register is used to allow test data to flow through the device from TDI
toTDO. Itcontainsasinglestageshiftregisterforaminimumlengthinserialpath.
When the bypass register is selected by an instruction, the shift register stage
is set to a logic zero on the rising edge of TCLK when the TAP controller is in
the Capture-DR state.
The operation of the bypass register should not have any effect on the
operation of the device in response to the BYPASS instruction.
THE BOUNDARY-SCAN REGISTER
The Boundary Scan Register allows serial data TDI be loaded in to or read
out of the processor input/output ports. The Boundary Scan Register is a part
of the IEEE 1149.1-1990 Standard JTAG Implementation.
THE DEVICE IDENTIFICATION REGISTER
The Device Identification Register is a Read Only 64-bit register used to
specify the manufacturer, part number and version of the processor to be
determined through the TAP in response to the IDCODE instruction.
IDT JEDEC ID number is 0xB3. This translates to 0x33 when the parity
is dropped in the 11-bit Manufacturer ID field.
For the IDT72T36135M, the Part Number field contains the following
values:
IDT72T36135M JTAG Device Identification Register
31(MSB)
28 27
12 11
1 0(LSB)
Version (4 bits)
Part Number (16-bit) Manufacturer ID (11-bit)
0X0
0X33
1
Device
Part# Field
IDT72T36135M
0417
Please note:
The IDT72T36135M device is a two die MCM which means 64 bits will be
shifted out of the device when the user is in IDCODE. Since the JTAG device
identification register is 32 bits per die.
JTAG INSTRUCTION REGISTER
TheInstructionregisterallowsinstructiontobeseriallyinputintothedevice
when the TAP controller is in the Shift-IR state. The instruction is decoded to
perform the following:
Select test data registers that may operate while the instruction is
current. The other test data registers should not interfere with chip
operation and the selected data register.
Definetheserialtestdataregisterpaththatisusedtoshiftdatabetween
TDI and TDO during data register scanning.
The Instruction Register is a 8 bit field (i.e.IR3, IR2, IR1, IR0 per die) to
decode 32 different possible instructions. Instructions are decoded as follows.
Please note:
Again,sincethisdeviceisatwodieMCM,theJTAGinstructionsmustbeshifted
in twice during JTAG testing. To account for each dies 4bit instruction registers
for a total of 8 bits altogether.
JTAG INSTRUCTION DESCRIPTION
Hex
Instruction
Function
Value
0x00
EXTEST
Select Boundary Scan Register
0x22
IDCODE
SelectChipIdentificationdataregister
0x11
SAMPLE/PRELOAD
Select Boundary Scan Register
0x33
HIGH-IMPEDANCE
JTAG
0xFF
BYPASS
Select Bypass Register
JTAG Instruction Register Decoding
The following sections provide a brief description of each instruction. For
acompletedescriptionrefertotheIEEEStandardTestAccessPortSpecification
(IEEE Std. 1149.1-1990).
EXTEST
The required EXTEST instruction places the IC into an external boundary-
testmodeandselectstheboundary-scanregistertobeconnectedbetweenTDI
and TDO. During this instruction, the boundary-scan register is accessed to
drive test data off-chip via the boundary outputs and receive test data off-chip
via the boundary inputs. As such, the EXTEST instruction is the workhorse of
IEEE. Std 1149.1, providing for probe-less testing of solder-joint opens/shorts
and of logic cluster function.
IDCODE
TheoptionalIDCODEinstructionallowstheICtoremaininitsfunctionalmode
andselectstheoptionaldeviceidentificationregistertobeconnectedbetween
TDIandTDO.Thedeviceidentificationregisterisa64-bitshiftregistercontaining
information regarding the IC manufacturer, device type, and version code.
Accessingthedeviceidentificationregisterdoesnotinterferewiththeoperation
oftheIC.Also,accesstothedeviceidentificationregistershouldbeimmediately
available, via a TAP data-scan operation, after power-up of the IC or after the
TAP has been reset using the optional
TRSTpinorbyotherwisemovingtothe
Test-Logic-Resetstate.
SAMPLE/PRELOAD
The required SAMPLE/PRELOAD instruction allows the IC to remain in a
normalfunctionalmodeandselectstheboundary-scanregistertobeconnected
between TDI and TDO. During this instruction, the boundary-scan register can
be accessed via a date scan operation, to take a sample of the functional data
enteringandleavingtheIC.Thisinstructionisalsousedtopreloadtestdatainto
the boundary-scan register before loading an EXTEST instruction.
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相關代理商/技術參數 |
參數描述 |
|---|---|
| IDT72T36135ML6BB | 功能描述:IC FIFO 1MX18 6NS 240BGA RoHS:否 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:72T 標準包裝:15 系列:74F 功能:異步 存儲容量:256（64 x 4） 數據速率:- 訪問時間:- 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:通孔 封裝/外殼:24-DIP（0.300"，7.62mm） 供應商設備封裝:24-PDIP 包裝:管件 其它名稱:74F433 |
| IDT72T36135ML6BBI | 制造商:Integrated Device Technology Inc 功能描述:IC FIFO 512KX36 ASYNC 240BGA |
| IDT72T3645L4-4BB | 功能描述:IC FIFO 1024X36 4-4NS 208-BGA RoHS:否 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:72T 標準包裝:90 系列:7200 功能:同步 存儲容量:288K（16K x 18） 數據速率:100MHz 訪問時間:10ns 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:64-LQFP 供應商設備封裝:64-TQFP（14x14） 包裝:托盤 其它名稱:72271LA10PF |
| IDT72T3645L4-4BBG | 功能描述:IC FIFO 1024X36 4-4NS 208-BGA RoHS:是 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:72T 標準包裝:90 系列:7200 功能:同步 存儲容量:288K（16K x 18） 數據速率:100MHz 訪問時間:10ns 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:64-LQFP 供應商設備封裝:64-TQFP（14x14） 包裝:托盤 其它名稱:72271LA10PF |
| IDT72T3645L5BB | 功能描述:IC FIFO 1024X36 5NS 208-BGA RoHS:否 類別:集成電路 (IC) >> 邏輯 - FIFO 系列:72T 標準包裝:90 系列:7200 功能:同步 存儲容量:288K（16K x 18） 數據速率:100MHz 訪問時間:10ns 電源電壓:4.5 V ~ 5.5 V 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:64-LQFP 供應商設備封裝:64-TQFP（14x14） 包裝:托盤 其它名稱:72271LA10PF |
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