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參數(shù)資料
| 型號： | HS-6664RH |
| 廠商： | Intersil Corporation |
| 英文描述： | Radiation Hardened 8K x 8 CMOS PROM |
| 中文描述： | 輻射加固8K的× 8的CMOS胎膜早破 |
| 文件頁數(shù)： | 7/14頁 |
| 文件大?。?/td> | 222K |
| 代理商： | HS-6664RH |
846
HS-6664RH
Intersil - Space Level (-Q) Product Flow
(Note 1)
SEM - Traceable to Diffusion Method 2018
Wafer Lot Acceptance Method 5007
Internal Visual Inspection Method 2010, Condition A
Gamma Radiation Assurance Tests Method 1019
Nondestructive Bond Pull Method 2023
Customer Pre-Cap Visual Inspection (Note 2)
Temperature Cycling Method 1010, Condition C
Constant Acceleration Method 2001, Condition E Min, Y1
Particle Impact Noise Detection Method 2020, Condition A
Electrical Tests (Intersil’ Option)
Serialization
X-Ray Inspection Method 2012
Electrical Tests - Subgroup 1; Read and Record (T0)
Static Burn-In Method 1015, Condition B, 72 Hrs, +125
o
C Min.
Interim 1 Electrical Tests - Subgroup 1; Read and Record (T1)
Burn-In Delta Calculation (T0 -T1)
PDA Calculation 3% Subgroup 7
5% Subgroups 1, 7,
Dynamic Burn-In Method 1015, Condition D, 240 Hrs, +125
o
C
(Note 3)
Interim 2 Electrical Tests - Subgroup 1; Read and Record (T2)
Alternate Group A - Subgroups 1, 7, 9; Method 5005; Para
3.5.1.1
Burn-In Delta Calculation (T0 - T2)
PDA Calculation 3% Subgroup 7
5% Subgroups 1, 7,
Electrical Tests - Subgroup 3; Read and Record
Alternate Group A - Subgroups 3, 8B, 11; Method 5005; Para
3.5.1.1
Marking
Electrical Tests - Subgroup 2; Read and Record
Alternate Group A - Subgroups 2, 8A, 10; Method 5005;
Para 3.5.1.1
Gross Leak Tests Method 1014, 100%
Fine Leak Tests Method 1014, 100%
Customer Source Inspection (Note 2)
Group B Inspection Method 5005 (Note 2)
End-Point Electrical Parameters: B-5 - Subgroups 1, 2, 3,
7, 8A, 8B, 9, 10, 11; B-6 - Subgroups 1, 7, 9
Group D Inspection Method 5005 (Notes 2, 4)
End-Point Electrical Parameters: Subgroups 1, 7, 9
External Visual Inspection Method 2009
Data Package Generation (Note 4)
NOTES:
1. The notes of Method 5004, Table 1 shall apply; Unless Otherwise Specified.
2. These steps are optional, and should be listed on the individual purchase order(s), when required.
3. Intersil reserves the right of performing burn-in time temperature regression as defined by Table 1 of Method 1015.
4. Data package contains:
Assembly Attributes (post seal)
Test Attributes (includes Group A)
Shippable Serial Number List
Radiation Testing Certificate of Conformance
Wafer Lot Acceptance Report (Including SEM Report)
X-Ray Report and Film
Test Variables Data
Intersil -8 Product Flow
Internal Visual Inspection Method 2010 Condition B
Alternate
Gamma Radiation Assurance Tests Method 1019
Customer Pre-Cap Visual Inspection (Note 1)
Temperature Cycling Method 1010, Condition C
Fine and Gross Leak Tests Method 1014
Constant Acceleration Method 2001 Y1 30KG
Initial Electrical Tests
Dynamic Burn-In Method 1015, Condition D, 160 Hrs, +125
o
C
+25
o
C Electrical Tests - Subgroups 1, 7, 9
PDA Calculation 5% Subgroups 1, 7
Electrical Tests +125
o
C, -55
o
C
Group A Inspection Method 5005. 5% PDA (Note 3)
Brand
Customer Source Inspection (Note 1)
Group B Inspection Method 5005 (Notes 1, 2)
Group C Inspection Method 5005 (Notes 1, 2)
Group D Inspection Method 5005 (Notes 1, 2)
External Visual Inspection Method 2009
Data Package Generation (Note 4)
NOTES:
1. These steps are optional, and must be negotiated as part of order.
2. Group B, C and D data package contains Attributes Data.
3. Intersil reserves the right to perform Alternate Group A. The 5% PDA is still applicable.
4. ‘-8’ Data package contains:
Assembly Attributes (post seal)
Test Attributes (includes Group A)
Radiation Testing Certificate of Conformance
Certificate of Conformance (as found on shipper)
Spec Number
518741
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| HS-6664RH_00 | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened 8K x 8 CMOS PROM |
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